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Chemical content 74AVC1T45GX

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Type numberPackagePackage descriptionTotal product weight
74AVC1T45GXSOT1255-2X2SON60.75365 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935308468147812601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04764100.000006.32082
subTotal0.04764100.000006.32082
ComponentAdditiveNon hazardousProprietary0.000255.000000.03317
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03317
Silica -amorphous-7631-86-90.0025050.000000.33172
PolymerEpoxy resin systemProprietary0.0015030.000000.19903
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06634
subTotal0.00500100.000000.66343
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100036.36688
Magnesium (Mg)7439-95-40.000440.150000.05772
Nickel (Ni)7440-02-00.008562.950001.13514
Silicon (Si)7440-21-30.001860.640000.24627
Pure metal layerGold (Au)7440-57-50.000060.020000.00770
Nickel (Ni)7440-02-00.004761.640000.63106
Palladium (Pd)7440-05-30.000260.090000.03463
subTotal0.29000100.0000038.47940
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.21652
FillerSilica -amorphous-7631-86-90.001150.290000.15315
Silica fused60676-86-00.3428886.1500045.49552
HardenerPhenolic resinProprietary0.017074.290002.26553
PigmentCarbon black1333-86-40.000760.190000.10034
PolymerEpoxy resin systemProprietary0.034518.670004.57860
subTotal0.39800100.0000052.80966
WireGold alloyGold (Au)7440-57-50.0128899.000001.70965
Palladium (Pd)7440-05-30.000131.000000.01727
subTotal0.01301100.000001.72692
total0.75365100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.