NXT4559
Parametrics
| Type number | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|
| NXT4559UP | 1.08 - 1.98 | 1.62 - 3.3 | CMOS | ± 1 | 20 | 3 | low | -40~85 | WLCSP9 | Application specific |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| NXT4559UP | NXT4559UPZ (935691709336) |
Active | z9 |
WLCSP9 (SOT8027-1) |
SOT8027-1 | SOT8027-1_336 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| NXT4559UP | NXT4559UPZ | NXT4559UP |
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Documentation (5)
| File name | Title | Type | Date |
|---|---|---|---|
| NXT4559 | SIM card interface level translator | Data sheet | 2024-02-27 |
| SOT8027-1 | 3D model for products with SOT8027-1 package | Design support | 2023-02-07 |
| nxt4559up | NXT4559UP IBIS model | IBIS model | 2023-12-21 |
| SIM_card_NXT4558_NXT4559_leaflet | SIM card interface level translators | Leaflet | 2024-06-28 |
| SOT8027-1 | wafer level chip-scale package; 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body | Package information | 2022-09-27 |
Support
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Ordering, pricing & availability
Sample
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