74LVC16374A-Q100; 74LVCH16374A-Q100
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74LVC16374ADGG-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 3.8 | 150 | low | -40~125 | TSSOP48 |
| 74LVCH16374ADGG-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 3.8 | 150 | low | -40~125 | TSSOP48 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC16374ADGG-Q100 | 74LVC16374ADGG-Q1J (935300232118) |
Active | LVC16374A |
TSSOP48 (SOT362-1) |
SOT362-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT362-1_118 |
| 74LVCH16374ADGG-Q100 | 74LVCH16374ADGG-QJ (935300357118) |
Active | LVCH16374A |
TSSOP48 (SOT362-1) |
SOT362-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT362-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC16374ADGG-Q100 | 74LVC16374ADGG-Q1J | 74LVC16374ADGG-Q100 |
|
|
| 74LVCH16374ADGG-Q100 | 74LVCH16374ADGG-QJ | 74LVCH16374ADGG-Q100 |
|
|
Documentation (10)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LVC_LVCH16374A_Q100 | 16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state | Data sheet | 2024-04-22 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| SOT362-1 | 3D model for products with SOT362-1 package | Design support | 2020-01-22 |
| lvc16374a | lvc16374a IBIS model | IBIS model | 2013-04-08 |
| lvch16374a | lvch16374a IBIS model | IBIS model | 2013-04-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP48_SOT362-1_mk | plastic, thin shrink small outline package; 48 leads; 0.5 mm pitch; 12.8 mm x 6.1 mm x 1.2 mm body | Marcom graphics | 2017-01-28 |
| SOT362-1 | plastic thin shrink small outline package; 48 leads; body width 6.1 mm | Package information | 2024-01-05 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT362-1 | 3D model for products with SOT362-1 package | Design support | 2020-01-22 |
| lvc16374a | lvc16374a IBIS model | IBIS model | 2013-04-08 |
| lvch16374a | lvch16374a IBIS model | IBIS model | 2013-04-09 |
Ordering, pricing & availability
Sample
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