Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 2N7002AKQB-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
2N7002AKQB-QSOT8015DFN1110D-31.599514 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346673731473126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00532076.0000000.332601
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00073310.4700000.045820
Phenolic resinProprietary0.00094713.5300000.059212
subTotal0.007000100.0000000.437633
DieDoped siliconSilicon (Si)7440-21-30.027000100.0000001.688013
subTotal0.027000100.0000001.688013
Lead FrameCopper alloyCopper (Cu)7440-50-80.71880795.58600044.939070
Magnesium (Mg)7439-95-40.0011200.1490000.070051
Nickel (Ni)7440-02-00.0224162.9809001.401449
Silicon (Si)7440-21-30.0048570.6459000.303665
Pure metal layerGold (Au)7440-57-50.0000580.0077000.003620
Nickel (Ni)7440-02-00.0044670.5940000.279265
Palladium (Pd)7440-05-30.0002740.0365000.017160
subTotal0.752000100.00000047.014281
Mould CompoundFillerSilica -amorphous-7631-86-90.0600107.9800003.751740
Silica fused60676-86-00.60229280.09200037.654678
PigmentCarbon black1333-86-40.0069790.9280000.436293
PolymerEpoxy resin systemProprietary0.0635448.4500003.972707
Phenolic resinProprietary0.0191762.5500001.198864
subTotal0.752000100.00000047.014281
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000160
Non hazardousProprietary0.0000320.0555000.001978
Tin solderTin (Sn)7440-31-50.05696699.9400003.561444
subTotal0.057000100.0000003.563582
WireImpurityNon hazardousProprietary0.0000000.0100000.000028
Pure metalCopper (Cu)7440-50-80.00451499.9900000.282183
subTotal0.004514100.0000000.282211
total1.599514100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.