Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHC273BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHC273BQ-Q100SOT764-1DHVQFN2028.375398 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353001871155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.003005
FillerSilver (Ag)7440-22-40.06396075.0000000.225407
PolymerAcrylic resinProprietary0.0051176.0000000.018033
Resin systemProprietary0.01535018.0000000.054098
subTotal0.085280100.0000000.300542
DieDoped siliconSilicon (Si)7440-21-30.339085100.0000001.194996
subTotal0.339085100.0000001.194996
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.49847497.47000036.998509
Iron (Fe)7439-89-60.2585042.4000000.911013
Phosphorus (P)7723-14-00.0032310.0300000.011388
Zinc (Zn)7440-66-60.0107710.1000000.037959
subTotal10.770980100.00000037.958868
Mould CompoundAdditiveNon hazardousProprietary0.4886282.9840001.722011
FillerSilica -amorphous-7631-86-90.5714853.4900002.014015
Silica fused60676-86-013.88920784.82000048.948061
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.578236
PigmentCarbon black1333-86-40.0268550.1640000.094641
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060363.7010002.135779
Epoxy resin systemProprietary0.2597061.5860000.915251
Phenolic resinProprietary0.3689272.2530001.300165
subTotal16.374920100.00000057.708160
Pre-PlatingPure metal layerGold (Au)7440-57-50.0215443.0000000.075924
Nickel (Ni)7440-02-00.66282592.3000002.335914
Palladium (Pd)7440-05-30.0222623.1000000.078454
Silver (Ag)7440-22-40.0114901.6000000.040493
subTotal0.718120100.0000002.530784
WirePure metalCopper (Cu)7440-50-80.08401196.5500000.296069
Pure metal layerGold (Au)7440-57-50.0003050.3500000.001073
Palladium (Pd)7440-05-30.0026973.1000000.009506
subTotal0.087013100.0000000.306649
total28.375398100.000000100.000000
Disclaimer
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