Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC573BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC573BQ-Q100SOT764-1DHVQFN2028.348221 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352988631159126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.003008
FillerSilver (Ag)7440-22-40.06396075.0000000.225623
PolymerAcrylic resinProprietary0.0051176.0000000.018050
Resin systemProprietary0.01535018.0000000.054149
subTotal0.085280100.0000000.300830
DieDoped siliconSilicon (Si)7440-21-30.311404100.0000001.098498
subTotal0.311404100.0000001.098498
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.49847497.47000037.033979
Iron (Fe)7439-89-60.2585042.4000000.911886
Phosphorus (P)7723-14-00.0032310.0300000.011399
Zinc (Zn)7440-66-60.0107710.1000000.037995
subTotal10.770980100.00000037.995259
Mould CompoundAdditiveNon hazardousProprietary0.4886282.9840001.723662
FillerSilica -amorphous-7631-86-90.5714853.4900002.015946
Silica fused60676-86-013.88920784.82000048.994987
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.578790
PigmentCarbon black1333-86-40.0268550.1640000.094732
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060363.7010002.137827
Epoxy resin systemProprietary0.2597061.5860000.916129
Phenolic resinProprietary0.3689272.2530001.301411
subTotal16.374920100.00000057.763484
Pre-PlatingPure metal layerGold (Au)7440-57-50.0215443.0000000.075996
Nickel (Ni)7440-02-00.66282592.3000002.338153
Palladium (Pd)7440-05-30.0222623.1000000.078530
Silver (Ag)7440-22-40.0114901.6000000.040531
subTotal0.718120100.0000002.533210
WirePure metalCopper (Cu)7440-50-80.08449796.5500000.298070
Pure metal layerGold (Au)7440-57-50.0003060.3500000.001081
Palladium (Pd)7440-05-30.0027133.1000000.009570
subTotal0.087517100.0000000.308721
total28.348221100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.