Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT02BZ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT02BZSOT8014-1DHXQFN145.553851 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356914281473126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.00670860.0000000.120781
ImpurityNon hazardousProprietary0.0000040.0395000.000080
PolymerResin systemProprietary0.00446739.9514100.080423
subTotal0.011180100.0000000.201283
DieDoped siliconSilicon (Si)7440-21-30.084299100.0000001.517855
subTotal0.084299100.0000001.517855
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.69450597.00000048.515972
Nickel (Ni)7440-02-00.0833353.0000001.500494
subTotal2.777840100.00000050.016466
Mould CompoundAdditiveNon hazardousProprietary0.0783502.9840001.410727
FillerSilica -amorphous-7631-86-90.0916363.4900001.649946
Silica fused60676-86-02.22708584.82000040.099830
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.0263091.0020000.473709
PigmentCarbon black1333-86-40.0043060.1640000.077533
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.0971763.7010001.749699
Epoxy resin systemProprietary0.0416431.5860000.749803
Phenolic resinProprietary0.0591562.2530001.065137
subTotal2.625660100.00000047.276385
Pre-PlatingPure metal layerGold (Au)7440-57-50.0001371.0000000.002470
Nickel (Ni)7440-02-00.01248591.0000000.224803
Palladium (Pd)7440-05-30.0010988.0000000.019763
subTotal0.013720100.0000000.247036
WirePure metalCopper (Cu)7440-50-80.03973296.5500000.715393
Pure metal layerGold (Au)7440-57-50.0001440.3500000.002593
Palladium (Pd)7440-05-30.0012763.1000000.022970
subTotal0.041152100.0000000.740956
total5.553851100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.