Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT08BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT08BQ-Q100SOT762-1DHVQFN1418.168396 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352987521156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001280
FillerSilver (Ag)7440-22-40.01744575.0000000.096018
PolymerAcrylic resinProprietary0.0013966.0000000.007681
Resin systemProprietary0.00418718.0000000.023044
subTotal0.023260100.0000000.128025
DieDoped siliconSilicon (Si)7440-21-30.192365100.0000001.058788
subTotal0.192365100.0000001.058788
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.74471097.47000037.123308
Iron (Fe)7439-89-60.1660752.4000000.914086
Phosphorus (P)7723-14-00.0020760.0300000.011426
Zinc (Zn)7440-66-60.0069200.1000000.038087
subTotal6.919780100.00000038.086907
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.727820
FillerSilica -amorphous-7631-86-90.3671483.4900002.020808
Silica fused60676-86-08.92307284.82000049.113155
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054111.0020000.580186
PigmentCarbon black1333-86-40.0172530.1640000.094961
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893463.7010002.142983
Epoxy resin systemProprietary0.1668471.5860000.918338
Phenolic resinProprietary0.2370162.2530001.304550
subTotal10.520010100.00000057.902800
Pre-PlatingPure metal layerGold (Au)7440-57-50.0138423.0000000.076187
Nickel (Ni)7440-02-00.42587292.3000002.344028
Palladium (Pd)7440-05-30.0143033.1000000.078727
Silver (Ag)7440-22-40.0073821.6000000.040633
subTotal0.461400100.0000002.539575
WirePure metalCopper (Cu)7440-50-80.04980296.5500000.274114
Pure metal layerGold (Au)7440-57-50.0001810.3500000.000994
Palladium (Pd)7440-05-30.0015993.1000000.008801
subTotal0.051582100.0000000.283908
total18.168396100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.