Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT157BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT157BQ-Q100SOT763-1DHVQFN1621.651844 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352989071157126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0009971.0000000.004604
FillerSilver (Ag)7440-22-40.07476075.0000000.345282
PolymerAcrylic resinProprietary0.0059816.0000000.027623
Resin systemProprietary0.01794218.0000000.082868
subTotal0.099680100.0000000.460376
DieDoped siliconSilicon (Si)7440-21-30.326829100.0000001.509475
subTotal0.326829100.0000001.509475
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.97467497.47000036.831384
Iron (Fe)7439-89-60.1963602.4000000.906898
Phosphorus (P)7723-14-00.0024550.0300000.011336
Zinc (Zn)7440-66-60.0081820.1000000.037787
subTotal8.181670100.00000037.787405
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.714237
FillerSilica -amorphous-7631-86-90.4341033.4900002.004922
Silica fused60676-86-010.55031084.82000048.727075
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.575625
PigmentCarbon black1333-86-40.0203990.1640000.094214
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603483.7010002.126137
Epoxy resin systemProprietary0.1972741.5860000.911119
Phenolic resinProprietary0.2802392.2530001.294295
subTotal12.438470100.00000057.447624
Pre-PlatingPure metal layerGold (Au)7440-57-50.0163653.0000000.075584
Nickel (Ni)7440-02-00.50350692.3000002.325464
Palladium (Pd)7440-05-30.0169113.1000000.078103
Silver (Ag)7440-22-40.0087281.6000000.040311
subTotal0.545510100.0000002.519462
WirePure metalCopper (Cu)7440-50-80.05762696.5500000.266147
Pure metal layerGold (Au)7440-57-50.0002090.3500000.000965
Palladium (Pd)7440-05-30.0018503.1000000.008545
subTotal0.059685100.0000000.275657
total21.651844100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.