Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT86PW-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
93529888911874HCT86PW-Q100,11874HCT86PW-Q100SOT402-1 (TSSOP14)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 7566 ppm; substance 1333-86-4: 1327 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 7566 ppm; substance 1333-86-4: 1327 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 392 ppm; substance 7440-57-5: 246 ppm; substance 7440-05-3: 254 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.01558077.9000000.026112
AdhesivePolymerAcrylic resin0.00304015.2000000.005095
AdhesivePolymerResin system0.0013806.9000000.002313
Adhesive Total0.020000100.0000000.033520
DieDoped siliconSilicon (Si)7440-21-30.199926100.0000000.335074
Die Total0.199926100.0000000.335074
Lead FrameCopper alloyCopper (Cu)7440-50-818.78091895.05701831.476671
Lead FrameCopper alloyIron (Fe)7439-89-60.4624422.3405850.775049
Lead FrameCopper alloyZinc (Zn)7440-66-60.0192680.0975220.032294
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0057810.0292590.009688
Base Alloy Total19.26840997.52438432.293702
Lead FramePure metal layerGold (Au)7440-57-50.0146740.0742700.024593
Pre-Plating 1 Total0.0146740.0742700.024593
Lead FramePure metal layerPalladium (Pd)7440-05-30.0151630.0767450.025413
Pre-Plating 2 Total0.0151630.0767450.025413
Lead FramePure metal layerNickel (Ni)7440-02-00.4514582.2849910.756640
Pre-Plating 3 Total0.4514582.2849910.756640
Lead FramePure metal layerSilver (Ag)7440-22-40.0078260.0396100.013116
Pre-Plating 4 Total0.0078260.0396100.013116
Lead Frame Total19.757530100.00000033.113464
Mould CompoundFillerSilica fused60676-86-031.01868078.33000051.987063
Mould CompoundPolymerEpoxy resin system3.5093528.8620005.881646
Mould CompoundFlame retardantMagnesium hydroxide (Mg(OH)2)1309-42-82.4156006.1000004.048527
Mould CompoundPolymerPhenolic resin2.3395685.9080003.921097
Mould CompoundFillerSilica7631-86-90.2376000.6000000.398216
Mould CompoundPigmentCarbon black1333-86-40.0792000.2000000.132739
Mould Compound Total39.600000100.00000066.369288
WirePure metalCopper (Cu)7440-50-80.088696100.0000000.148654
Wire Total0.088696100.0000000.148654
74HCT86PW-Q100 Total59.666152100.000000100.000000
Notes
Report created on 2024-12-18 14:32:51 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-12-18 14:32:51 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)
半导体芯片 (Die)
基底合金 (Base Alloy)
预镀层1 (Pre-Plating 1)
预镀层2 (Pre-Plating 2)
预镀层3 (Pre-Plating 3)
预镀层4 (Pre-Plating 4)
模封料 (Mould Compound)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-12-18 14:32:51 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.