Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LV00BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LV00BQSOT762-1DHVQFN1418.18815 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528555911511126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0180060.000000.09897
ImpurityNon hazardousProprietary0.000010.039500.00007
PolymerResin systemProprietary0.0119939.951410.06590
subTotal0.03000100.000000.16494
DieDoped siliconSilicon (Si)7440-21-30.47862100.000002.63151
subTotal0.47862100.000002.63151
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.40332
Iron (Fe)7439-89-60.167512.400000.92098
Phosphorus (P)7723-14-00.002090.030000.01151
Zinc (Zn)7440-66-60.006980.100000.03837
subTotal6.97956100.0000038.37418
Mould CompoundAdditiveNon hazardousProprietary0.313922.984001.72594
FillerSilica -amorphous-7631-86-90.367153.490002.01861
Silica fused60676-86-08.9230684.8200049.05977
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.105411.002000.57956
PigmentCarbon black1333-86-40.017250.164000.09486
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.389353.701002.14065
Epoxy resin systemProprietary0.166851.586000.91734
Phenolic resinProprietary0.237022.253001.30313
subTotal10.52000100.0000057.83986
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00974
Nickel (Ni)7440-02-00.1612391.000000.88646
Palladium (Pd)7440-05-30.014178.000000.07793
subTotal0.17718100.000000.97413
WirePure metalCopper (Cu)7440-50-80.0027096.550000.01486
Pure metal layerGold (Au)7440-57-50.000010.350000.00005
Palladium (Pd)7440-05-30.000093.100000.00048
subTotal0.00280100.000000.01539
total18.18815100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.