Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LV164BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LV164BQSOT762-1DHVQFN1418.52100 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93527865411517126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00126
FillerSilver (Ag)7440-22-40.0174475.000000.09419
PolymerAcrylic resinProprietary0.001406.000000.00754
Resin systemProprietary0.0041918.000000.02261
subTotal0.02326100.000000.12560
DieDoped siliconSilicon (Si)7440-21-30.77660100.000004.19309
subTotal0.77660100.000004.19309
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700036.73113
Iron (Fe)7439-89-60.167512.400000.90443
Phosphorus (P)7723-14-00.002090.030000.01131
Zinc (Zn)7440-66-60.006980.100000.03768
subTotal6.97956100.0000037.68455
Mould CompoundAdditiveNon hazardousProprietary0.313922.984001.69492
FillerSilica -amorphous-7631-86-90.367153.490001.98233
Silica fused60676-86-08.9230684.8200048.17809
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.105411.002000.56914
PigmentCarbon black1333-86-40.017250.164000.09315
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.389353.701002.10218
Epoxy resin systemProprietary0.166851.586000.90085
Phenolic resinProprietary0.237022.253001.27971
subTotal10.52000100.0000056.80037
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00957
Nickel (Ni)7440-02-00.1612391.000000.87053
Palladium (Pd)7440-05-30.014178.000000.07653
subTotal0.17718100.000000.95663
WirePure metalCopper (Cu)7440-50-80.0428796.550000.23148
Pure metal layerGold (Au)7440-57-50.000160.350000.00084
Palladium (Pd)7440-05-30.001383.100000.00743
subTotal0.04441100.000000.23975
total18.52100100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.