Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC125ABQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC125ABQ-Q100SOT762-1DHVQFN1418.156200 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353014071156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001281
FillerSilver (Ag)7440-22-40.01744575.0000000.096083
PolymerAcrylic resinProprietary0.0013966.0000000.007687
Resin systemProprietary0.00418718.0000000.023060
subTotal0.023260100.0000000.128111
DieDoped siliconSilicon (Si)7440-21-30.180062100.0000000.991741
subTotal0.180062100.0000000.991741
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.74471097.47000037.148244
Iron (Fe)7439-89-60.1660752.4000000.914700
Phosphorus (P)7723-14-00.0020760.0300000.011434
Zinc (Zn)7440-66-60.0069200.1000000.038112
subTotal6.919780100.00000038.112490
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.728980
FillerSilica -amorphous-7631-86-90.3671483.4900002.022165
Silica fused60676-86-08.92307284.82000049.146146
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054111.0020000.580576
PigmentCarbon black1333-86-40.0172530.1640000.095024
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893463.7010002.144422
Epoxy resin systemProprietary0.1668471.5860000.918955
Phenolic resinProprietary0.2370162.2530001.305426
subTotal10.520010100.00000057.941695
Pre-PlatingPure metal layerGold (Au)7440-57-50.0138423.0000000.076238
Nickel (Ni)7440-02-00.42587292.3000002.345602
Palladium (Pd)7440-05-30.0143033.1000000.078780
Silver (Ag)7440-22-40.0073821.6000000.040660
subTotal0.461400100.0000002.541281
WirePure metalCopper (Cu)7440-50-80.04990596.5500000.274863
Pure metal layerGold (Au)7440-57-50.0001810.3500000.000996
Palladium (Pd)7440-05-30.0016023.1000000.008825
subTotal0.051688100.0000000.284685
total18.156200100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.