Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC1G125GZ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G125GZSOT8065-1XSON51.24676 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356915203153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04963100.000003.98064
subTotal0.04963100.000003.98064
ComponentAdditiveNon hazardousProprietary0.001105.000000.08823
FillerBisphenol A-epichlorohydrin resin25068-38-60.001105.000000.08823
Silica -amorphous-7631-86-90.0110050.000000.88229
PolymerEpoxy resin systemProprietary0.0066030.000000.52937
Phenol Formaldehyde resin (generic)9003-35-40.0022010.000000.17646
subTotal0.02200100.000001.76458
Lead FrameCopper alloyCopper (Cu)7440-50-80.4443995.5684435.64385
Magnesium (Mg)7439-95-40.000710.152090.05672
Nickel (Ni)7440-02-00.013872.983291.11267
Silicon (Si)7440-21-30.003020.648800.24198
Pure metal layerGold (Au)7440-57-50.000050.010820.00404
Nickel (Ni)7440-02-00.002780.596940.22264
Palladium (Pd)7440-05-30.000180.039620.01478
subTotal0.46500100.0000037.29668
Mould CompoundAdditiveNon hazardousProprietary0.002780.410000.22263
FillerSilica -amorphous-7631-86-90.001960.290000.15747
Silica fused60676-86-00.5832486.1500046.78009
HardenerPhenolic resinProprietary0.029044.290002.32950
PigmentCarbon black1333-86-40.001290.190000.10317
PolymerEpoxy resin systemProprietary0.058708.670004.70787
subTotal0.67700100.0000054.30073
Post-PlatingImpurityNon hazardousProprietary0.000000.010000.00018
Tin alloyTin (Sn)7440-31-50.0220099.990001.76440
subTotal0.02200100.000001.76458
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalCopper (Cu)7440-50-80.0107496.490000.86164
Pure metal layerGold (Au)7440-57-50.000060.500000.00446
Palladium (Pd)7440-05-30.000333.000000.02679
subTotal0.01113100.000000.89298
total1.24676100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.