Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC1G14GZ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G14GZSOT8065-1XSON51.23661 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356915393153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04103100.000003.31776
subTotal0.04103100.000003.31776
ComponentAdditiveNon hazardousProprietary0.001105.000000.08895
FillerBisphenol A-epichlorohydrin resin25068-38-60.001105.000000.08895
Silica -amorphous-7631-86-90.0110050.000000.88953
PolymerEpoxy resin systemProprietary0.0066030.000000.53372
Phenol Formaldehyde resin (generic)9003-35-40.0022010.000000.17791
subTotal0.02200100.000001.77906
Lead FrameCopper alloyCopper (Cu)7440-50-80.4443995.5684435.93641
Magnesium (Mg)7439-95-40.000710.152090.05719
Nickel (Ni)7440-02-00.013872.983291.12180
Silicon (Si)7440-21-30.003020.648800.24397
Pure metal layerGold (Au)7440-57-50.000050.010820.00407
Nickel (Ni)7440-02-00.002780.596940.22447
Palladium (Pd)7440-05-30.000180.039620.01490
subTotal0.46500100.0000037.60281
Mould CompoundAdditiveNon hazardousProprietary0.002780.410000.22446
FillerSilica -amorphous-7631-86-90.001960.290000.15876
Silica fused60676-86-00.5832486.1500047.16406
HardenerPhenolic resinProprietary0.029044.290002.34862
PigmentCarbon black1333-86-40.001290.190000.10402
PolymerEpoxy resin systemProprietary0.058708.670004.74652
subTotal0.67700100.0000054.74644
Post-PlatingImpurityNon hazardousProprietary0.000000.010000.00018
Tin alloyTin (Sn)7440-31-50.0220099.990001.77888
subTotal0.02200100.000001.77906
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalCopper (Cu)7440-50-80.0092596.490000.74769
Pure metal layerGold (Au)7440-57-50.000050.500000.00387
Palladium (Pd)7440-05-30.000293.000000.02325
subTotal0.00958100.000000.77489
total1.23661100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.