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Chemical content 74LVC1G3157GX

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Type numberPackagePackage descriptionTotal product weight
74LVC1G3157GXSOT1255-2X2SON60.75427 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935308636147812601235Hsin-chu, Taiwan; Shanghai, China; Hefei, China; Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04806100.000006.37123
subTotal0.04806100.000006.37123
ComponentAdditiveNon hazardousProprietary0.000255.000000.03314
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03314
Silica -amorphous-7631-86-90.0025050.000000.33145
PolymerEpoxy resin systemProprietary0.0015030.000000.19887
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06629
subTotal0.00500100.000000.66289
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100036.33699
Magnesium (Mg)7439-95-40.000440.150000.05767
Nickel (Ni)7440-02-00.008562.950001.13421
Silicon (Si)7440-21-30.001860.640000.24607
Pure metal layerGold (Au)7440-57-50.000060.020000.00769
Nickel (Ni)7440-02-00.004761.640000.63054
Palladium (Pd)7440-05-30.000260.090000.03460
subTotal0.29000100.0000038.44777
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.21634
FillerSilica -amorphous-7631-86-90.001150.290000.15302
Silica fused60676-86-00.3428886.1500045.45813
HardenerPhenolic resinProprietary0.017074.290002.26367
PigmentCarbon black1333-86-40.000760.190000.10026
PolymerEpoxy resin systemProprietary0.034518.670004.57483
subTotal0.39800100.0000052.76625
WireGold alloyGold (Au)7440-57-50.0130899.000001.73461
Palladium (Pd)7440-05-30.000131.000000.01752
subTotal0.01322100.000001.75213
total0.75427100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.