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Chemical content 74LVC574APW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC574APW-Q100SOT360-1TSSOP2083.30044 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691608118312601235Shanghai, China; Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.03741
PolymerAcrylic resinProprietary0.0060815.200000.00730
Resin systemProprietary0.002766.900000.00331
subTotal0.04000100.000000.04802
DieDoped siliconSilicon (Si)7440-21-30.30232100.000000.36292
subTotal0.30232100.000000.36292
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.7946697.4700035.76771
Iron (Fe)7439-89-60.733632.400000.88071
Phosphorus (P)7723-14-00.009170.030000.01101
Zinc (Zn)7440-66-60.030570.100000.03670
subTotal30.56803100.0000036.69613
Mould CompoundFillerSilica -amorphous-7631-86-90.308880.600000.37080
Silica fused60676-86-040.3242878.3300048.40825
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.140286.100003.76982
PigmentCarbon black1333-86-40.102960.200000.12360
PolymerEpoxy resin systemProprietary4.562168.862005.47675
Phenolic resinProprietary3.041445.908003.65117
subTotal51.48000100.0000061.80039
Pre-PlatingPure metal layerGold (Au)7440-57-50.023283.000000.02795
Nickel (Ni)7440-02-00.7162192.300000.85979
Palladium (Pd)7440-05-30.024053.100000.02888
Silver (Ag)7440-22-40.012421.600000.01490
subTotal0.77596100.000000.93152
WirePure metalCopper (Cu)7440-50-80.13413100.000000.16102
subTotal0.13413100.000000.16102
total83.30044100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.