Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVCH8T245BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVCH8T245BQ-Q100SOT815-1DHVQFN2450.78631 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353011031185126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001271.000000.00250
FillerSilver (Ag)7440-22-40.0953975.000000.18783
PolymerAcrylic resinProprietary0.007636.000000.01503
Resin systemProprietary0.0228918.000000.04508
subTotal0.12719100.000000.25044
DieDoped siliconSilicon (Si)7440-21-30.95361100.000001.87770
subTotal0.95361100.000001.87770
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0780897.4700037.56539
Iron (Fe)7439-89-60.469762.400000.92497
Phosphorus (P)7723-14-00.005870.030000.01156
Zinc (Zn)7440-66-60.019570.100000.03854
subTotal19.57328100.0000038.54046
Mould CompoundAdditiveNon hazardousProprietary0.880352.984001.73344
FillerSilica -amorphous-7631-86-91.029633.490002.02739
Silica fused60676-86-025.0239484.8200049.27301
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.295611.002000.58207
PigmentCarbon black1333-86-40.048380.164000.09527
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-71.091883.701002.14996
Epoxy resin systemProprietary0.467911.586000.92133
Phenolic resinProprietary0.664692.253001.30880
subTotal29.50241100.0000058.09127
Pre-PlatingPure metal layerGold (Au)7440-57-50.004971.000000.00978
Nickel (Ni)7440-02-00.4521491.000000.89028
Palladium (Pd)7440-05-30.039758.000000.07827
subTotal0.49686100.000000.97833
WirePure metalCopper (Cu)7440-50-80.1283796.550000.25277
Pure metal layerGold (Au)7440-57-50.000470.350000.00092
Palladium (Pd)7440-05-30.004123.100000.00812
subTotal0.13296100.000000.26181
total50.78631100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.