Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74VHCT32BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74VHCT32BQ-Q100SOT762-1DHVQFN1418.147318 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353013251155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001282
FillerSilver (Ag)7440-22-40.01744575.0000000.096130
PolymerAcrylic resinProprietary0.0013966.0000000.007690
Resin systemProprietary0.00418718.0000000.023071
subTotal0.023260100.0000000.128173
DieDoped siliconSilicon (Si)7440-21-30.398290100.0000002.194761
subTotal0.398290100.0000002.194761
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.80283197.47000037.486701
Iron (Fe)7439-89-60.1675062.4000000.923034
Phosphorus (P)7723-14-00.0020940.0300000.011538
Zinc (Zn)7440-66-60.0069790.1000000.038460
subTotal6.979410100.00000038.459733
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.729826
FillerSilica -amorphous-7631-86-90.3671483.4900002.023155
Silica fused60676-86-08.92307284.82000049.170200
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054111.0020000.580860
PigmentCarbon black1333-86-40.0172530.1640000.095071
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893463.7010002.145472
Epoxy resin systemProprietary0.1668471.5860000.919405
Phenolic resinProprietary0.2370162.2530001.306065
subTotal10.520010100.00000057.970054
Pre-PlatingPure metal layerGold (Au)7440-57-50.0017721.0000000.009763
Nickel (Ni)7440-02-00.16123491.0000000.888472
Palladium (Pd)7440-05-30.0141748.0000000.078107
subTotal0.177180100.0000000.976343
WirePure metalCopper (Cu)7440-50-80.04747296.5500000.261591
Pure metal layerGold (Au)7440-57-50.0001720.3500000.000948
Palladium (Pd)7440-05-30.0015243.1000000.008399
subTotal0.049168100.0000000.270938
total18.147318100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.