Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAW56W-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAW56W-QSOT323SC-705.534694 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346636251351126030 s123520 s3
9346636251151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000000.903392
subTotal0.050000100.0000000.903392
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016650.0900000.030083
Carbon (C)7440-44-00.0007400.0400000.013370
Chromium (Cr)7440-47-30.0016650.0900000.030083
Cobalt (Co)7440-48-40.0079550.4300000.143730
Iron (Fe)7439-89-60.82602544.65000014.924493
Manganese (Mn)7439-96-50.0127650.6900000.230636
Nickel (Ni)7440-02-00.63899034.54000011.545173
Phosphorus (P)7723-14-00.0003700.0200000.006685
Silicon (Si)7440-21-30.0048100.2600000.086906
Sulphur (S)7704-34-90.0003700.0200000.006685
Pure metal layerCopper (Cu)7440-50-80.31172516.8500005.632199
Silver (Ag)7440-22-40.0429202.3200000.775472
subTotal1.850000100.00000033.425515
Mould CompoundFillerSilica fused60676-86-02.55340075.10000046.134439
PigmentCarbon black1333-86-40.0102000.3000000.184292
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.59500017.50000010.750368
Phenol Formaldehyde resin (generic)9003-35-40.2414007.1000004.361578
subTotal3.400000100.00000061.430677
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000070.0030000.000125
Bismuth (Bi)7440-69-90.0000020.0010000.000042
Copper (Cu)7440-50-80.0000020.0010000.000042
Lead (Pb)7439-92-10.0000120.0050000.000208
Tin solderTin (Sn)7440-31-50.22997799.9900004.155189
subTotal0.230000100.0000004.155605
WirePure metalCopper (Cu)7440-50-80.004694100.0000000.084801
subTotal0.004694100.0000000.084801
total5.534694100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.