Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC807-16QC

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC807-16QCSOT8009DFN1412D-32.462106 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660893147412601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01064076.0000000.432150
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00146610.4700000.059534
Phenolic resinProprietary0.00189413.5300000.076934
subTotal0.014000100.0000000.568619
DieDoped siliconSilicon (Si)7440-21-30.080000100.0000003.249251
subTotal0.080000100.0000003.249251
Lead FrameCopper alloyCopper (Cu)7440-50-81.08950193.27920044.250778
Magnesium (Mg)7439-95-40.0016980.1454000.068976
Nickel (Ni)7440-02-00.0339762.9089001.379955
Silicon (Si)7440-21-30.0073620.6303000.299008
Pure metal layerGold (Au)7440-57-50.0004360.0373000.017695
Nickel (Ni)7440-02-00.0335472.8722001.362545
Palladium (Pd)7440-05-30.0014800.1267000.060105
subTotal1.168000100.00000047.439062
Mould CompoundFillerSilica -amorphous-7631-86-90.0887387.9800003.604134
Silica fused60676-86-00.89062380.09200036.173221
PigmentCarbon black1333-86-40.0103190.9280000.419127
PolymerEpoxy resin systemProprietary0.0939648.4500003.816408
Phenolic resinProprietary0.0283562.5500001.151697
subTotal1.112000100.00000045.164587
Post-PlatingImpurityLead (Pb)7439-92-10.0000040.0045000.000152
Non hazardousProprietary0.0000460.0555000.001871
Tin solderTin (Sn)7440-31-50.08295099.9400003.369075
subTotal0.083000100.0000003.371098
WireImpurityNon hazardousProprietary0.0000010.0100000.000021
Pure metalCopper (Cu)7440-50-80.00510599.9900000.207363
subTotal0.005106100.0000000.207383
total2.462106100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.