Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BST60-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BST60-QSOT89MPT340.434950 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346650151151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08470077.0000000.209472
PolymerResin systemProprietary0.02530023.0000000.062570
subTotal0.110000100.0000000.272042
DieDoped siliconSilicon (Si)7440-21-30.240000100.0000000.593546
subTotal0.240000100.0000000.593546
Lead FrameCopper alloyCopper (Cu)7440-50-817.12911299.82000042.362145
Iron (Fe)7439-89-60.0171600.1000000.042439
Phosphorus (P)7723-14-00.0051480.0300000.012732
Pure metal layerSilver (Ag)7440-22-40.0085800.0500000.021219
subTotal17.160000100.00000042.438534
Mould CompoundAdditiveNon hazardousProprietary0.6614902.9000001.635936
Triphenylphosphine603-35-00.0114050.0500000.028206
FillerSilica -amorphous-7631-86-916.42320072.00000040.616348
PigmentCarbon black1333-86-40.0114050.0500000.028206
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.42150015.0000008.461739
Phenol Formaldehyde resin (generic)9003-35-42.28100010.0000005.641159
subTotal22.810000100.00000056.411594
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000008
Non hazardousProprietary0.0000390.0555000.000096
Tin solderTin (Sn)7440-31-50.06995899.9400000.173014
subTotal0.070000100.0000000.173118
WirePure metalGold (Au)7440-57-50.044950100.0000000.111166
subTotal0.044950100.0000000.111166
total40.434950100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.