Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK6D72-30E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK6D72-30ESOT1220DFN2020MD-67.037640 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346609491152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.05600080.0000000.795721
PolymerAcrylic resinProprietary0.01400020.0000000.198930
subTotal0.070000100.0000000.994652
DieDoped siliconSilicon (Si)7440-21-30.170000100.0000002.415582
subTotal0.170000100.0000002.415582
Lead FrameCopper alloyCopper (Cu)7440-50-82.70491393.59560038.434942
Magnesium (Mg)7439-95-40.0042170.1459000.059914
Nickel (Ni)7440-02-00.0843532.9188001.198602
Silicon (Si)7440-21-30.0182760.6324000.259694
Pure metal layerGold (Au)7440-57-50.0009620.0333000.013675
Nickel (Ni)7440-02-00.0740132.5610001.051672
Palladium (Pd)7440-05-30.0032660.1130000.046403
subTotal2.890000100.00000041.064902
Mould CompoundFillerSilica -amorphous-7631-86-90.85790023.00000012.190166
Silica fused60676-86-02.23800060.00000031.800433
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1119003.0000001.590022
Ion trapping agentBismuth (Bi)7440-69-90.0186500.5000000.265004
PigmentCarbon black1333-86-40.0186500.5000000.265004
PolymerEpoxy resin systemProprietary0.2611007.0000003.710051
Phenolic resinProprietary0.2238006.0000003.180043
subTotal3.730000100.00000053.000722
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000109
Non hazardousProprietary0.0000940.0555000.001341
Tin solderTin (Sn)7440-31-50.16989899.9400002.414133
subTotal0.170000100.0000002.415582
WireImpurityNon hazardousProprietary0.0000010.0100000.000011
Pure metalCopper (Cu)7440-50-80.00763999.9900000.108548
subTotal0.007640100.0000000.108559
total7.037640100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.