Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9K25-40E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9K25-40ESOT1205LFPAK56D76.91200 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340678141154126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.30000100.000001.69024
subTotal1.30000100.000001.69024
ClipCopper alloyCopper (Cu)7440-50-84.9999899.800006.50091
Iron (Fe)7439-89-60.007520.150000.00977
Phosphorus (P)7723-14-00.002500.050000.00326
subTotal5.01000100.000006.51394
Lead FrameCopper alloyCopper (Cu)7440-50-835.3292099.8000045.93457
Iron (Fe)7439-89-60.053100.150000.06904
Phosphorus (P)7723-14-00.017700.050000.02301
subTotal35.40000100.0000046.02662
Mould CompoundAdditiveNon hazardousProprietary1.890805.800002.45839
FillerSilica -amorphous-7631-86-92.053806.300002.67032
Silica fused60676-86-023.4720072.0000030.51799
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.652002.000000.84772
PigmentCarbon black1333-86-40.097800.300000.12716
PolymerBromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.717202.200000.93249
Epoxy resin systemProprietary1.956006.000002.54317
Phenol Formaldehyde resin (generic)9003-35-41.760405.400002.28885
subTotal32.60000100.0000042.38609
Post-PlatingImpurityNon hazardousProprietary0.000190.010000.00025
Tin alloyTin (Sn)7440-31-51.9298199.990002.50911
subTotal1.93000100.000002.50936
Solder PasteLead alloyLead (Pb)7439-92-10.6216092.500000.80820
Silver (Ag)7440-22-40.016802.500000.02184
Tin (Sn)7440-31-50.033605.000000.04369
subTotal0.67200100.000000.87373
total76.91200100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.