Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX84W-C20-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX84W-C20-QSOT323SC-705.466794 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664671135112601235
934664671115112601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.040000100.0000000.731690
subTotal0.040000100.0000000.731690
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016600.0900000.030358
Carbon (C)7440-44-00.0007380.0400000.013492
Chromium (Cr)7440-47-30.0016600.0900000.030358
Cobalt (Co)7440-48-40.0079290.4300000.145043
Iron (Fe)7439-89-60.81965844.45000014.993395
Manganese (Mn)7439-96-50.0127240.6900000.232743
Nickel (Ni)7440-02-00.63415234.39000011.600064
Phosphorus (P)7723-14-00.0003690.0200000.006746
Silicon (Si)7440-21-30.0047940.2600000.087700
Sulphur (S)7704-34-90.0003690.0200000.006746
Pure metal layerCopper (Cu)7440-50-80.32030317.3700005.859061
Silver (Ag)7440-22-40.0396462.1500000.725215
subTotal1.844000100.00000033.730922
Mould CompoundAdditiveNon hazardousProprietary0.0977302.9000001.787702
Triphenylphosphine603-35-00.0016850.0500000.030822
FillerSilica -amorphous-7631-86-92.42640072.00000044.384332
PigmentCarbon black1333-86-40.0016850.0500000.030822
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.50550015.0000009.246736
Phenol Formaldehyde resin (generic)9003-35-40.33700010.0000006.164491
subTotal3.370000100.00000061.644906
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000060.0030000.000115
Bismuth (Bi)7440-69-90.0000020.0010000.000038
Copper (Cu)7440-50-80.0000020.0010000.000038
Lead (Pb)7439-92-10.0000100.0050000.000192
Tin solderTin (Sn)7440-31-50.20997999.9900003.840990
subTotal0.210000100.0000003.841374
WirePure metalCopper (Cu)7440-50-80.002794100.0000000.051104
subTotal0.002794100.0000000.051104
total5.466794100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.