Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8850-B12

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8850-B12SOD882DFN1006-20.92430 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346671383152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.82224
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11327
Phenolic resinProprietary0.0013513.530000.14638
subTotal0.01000100.000001.08189
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.24570
subTotal0.03000100.000003.24570
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.91377
Magnesium (Mg)7439-95-40.000820.200000.08872
Nickel (Ni)7440-02-00.012923.150001.39727
Silicon (Si)7440-21-30.002830.690000.30607
Pure metal layerGold (Au)7440-57-50.000120.030000.01331
Nickel (Ni)7440-02-00.005211.270000.56335
Palladium (Pd)7440-05-30.000700.170000.07541
subTotal0.41000100.0000044.35790
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.19766
Silica fused60676-86-00.2700060.0000029.21130
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.013503.000001.46056
Ion trapping agentBismuth (Bi)7440-69-90.002250.500000.24343
PigmentCarbon black1333-86-40.002250.500000.24343
PolymerEpoxy resin systemProprietary0.031507.000003.40798
Phenolic resinProprietary0.027006.000002.92113
subTotal0.45000100.0000048.68549
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00120
Tin solderTin (Sn)7440-31-50.0199999.940002.16250
subTotal0.02000100.000002.16380
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0043299.990000.46733
subTotal0.00432100.000000.46738
total0.92430100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.