Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8850S-B13-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8850S-B13-QSOD882BDDFN1006-20.89159 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346666453152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.61958
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22312
Phenolic resinProprietary0.0025713.530000.28833
subTotal0.01900100.000002.13103
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.36478
subTotal0.03000100.000003.36478
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000042.35355
Magnesium (Mg)7439-95-40.000590.150000.06645
Nickel (Ni)7440-02-00.011772.980001.32023
Silicon (Si)7440-21-30.002570.650000.28797
Pure metal layerGold (Au)7440-57-50.000040.010000.00443
Nickel (Ni)7440-02-00.002250.570000.25253
Palladium (Pd)7440-05-30.000160.040000.01772
subTotal0.39500100.0000044.30288
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.78598
Silica fused60676-86-00.3387980.0920037.99831
PigmentCarbon black1333-86-40.003930.928000.44027
PolymerEpoxy resin systemProprietary0.035748.450004.00896
Phenolic resinProprietary0.010792.550001.20980
subTotal0.42300100.0000047.44332
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00124
Tin solderTin (Sn)7440-31-50.0199999.940002.24184
subTotal0.02000100.000002.24318
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0045999.990000.51459
subTotal0.00459100.000000.51464
total0.89159100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.