Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8850S-B47-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8850S-B47-QSOD882BDDFN1006-20.90035 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346666583152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.60382
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22095
Phenolic resinProprietary0.0025713.530000.28552
subTotal0.01900100.000002.11029
DieDoped siliconSilicon (Si)7440-21-30.03900100.000004.33165
subTotal0.03900100.000004.33165
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000041.94147
Magnesium (Mg)7439-95-40.000590.150000.06581
Nickel (Ni)7440-02-00.011772.980001.30738
Silicon (Si)7440-21-30.002570.650000.28517
Pure metal layerGold (Au)7440-57-50.000040.010000.00439
Nickel (Ni)7440-02-00.002250.570000.25007
Palladium (Pd)7440-05-30.000160.040000.01755
subTotal0.39500100.0000043.87184
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.74914
Silica fused60676-86-00.3387980.0920037.62861
PigmentCarbon black1333-86-40.003930.928000.43599
PolymerEpoxy resin systemProprietary0.035748.450003.96996
Phenolic resinProprietary0.010792.550001.19803
subTotal0.42300100.0000046.98173
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00123
Tin solderTin (Sn)7440-31-50.0199999.940002.22003
subTotal0.02000100.000002.22136
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0043599.990000.48276
subTotal0.00435100.000000.48281
total0.90035100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.