| 12NC | OPN | Type No. | Package | State | MSL |
|---|---|---|---|---|---|
| 934665899341 | GAN3R2-100CBEAZ | GAN3R2-100CBE | WLCSP8-SOT8072 (WLCSP8) | RFS | 1 |
| REACH | Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article. |
| EU RoHS | Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions. |
| CN RoHS | Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS). |
| ELV | Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions. |
| PFAS | Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS). |
| CA Proposition 65 | Contains California Proposition 65 substance(s) [at the article level]: substance 872-50-4: 3 ppm; substance 7440-02-0: 4210 ppm; |
| IEC 62474 | Contains IEC 62474 substance(s) [at the article level]: substance 872-50-4: 3 ppm; substance 7440-02-0: 4210 ppm; |
| Precious Metals | Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 35751 ppm; |
| RHF Indicator | Lead-free and halogen-free according to Nexperia's halogen-free definition.   |
| Material | Material Group | Substance | CAS No. | Mass (mg) | Material (%) | Product (%) |
|---|---|---|---|---|---|---|
| Passivation | Polymer | Polyimide resin | 0.429610 | 90.398540 | 1.532132 | |
| Passivation | Polymer | Non hazardous | 0.045530 | 9.580420 | 0.162381 | |
| Passivation | Impurity | N-Methylpyrrolidone (NMP) | 872-50-4 | 0.000100 | 0.021040 | 0.000351 |
| Passivation Total | 0.475240 | 100.000000 | 1.694864 | |||
| Solder Bump 2 | Tin solder | Silver (Ag) | 7440-22-4 | 1.002470 | 100.000000 | 3.575143 |
| Solder Bump Total | 1.002470 | 100.000000 | 3.575143 | |||
| Solder Bump 2 Total | 1.002470 | 100.000000 | 3.575143 | |||
| Solder Bump 1 | Tin solder | Tin (Sn) | 7440-31-5 | 0.315570 | 100.000000 | 1.125428 |
| Solder Bump Total | 0.315570 | 100.000000 | 1.125428 | |||
| Solder Bump 1 Total | 0.315570 | 100.000000 | 1.125428 | |||
| Under Bump Metallization 1 | Pure metal layer | Titanium (Ti) | 7440-32-6 | 5.699390 | 100.000000 | 20.325927 |
| Under Bump Metallization 1 Total | 5.699390 | 100.000000 | 20.325927 | |||
| Under Bump Metallization 2 | Pure metal layer | Copper (Cu) | 7440-50-8 | 0.147920 | 100.000000 | 0.527532 |
| Under Bump Metallization 2 Total | 0.147920 | 100.000000 | 0.527532 | |||
| Die | Doped silicon | Silicon (Si) | 7440-21-3 | 18.926880 | 98.456070 | 67.499560 |
| Die | Metallisation | Gallium Nitride (GaN) | 25617-97-4 | 0.171050 | 0.889790 | 0.610040 |
| Die | Pure metal layer | Aluminium (Al) | 7429-90-5 | 0.125750 | 0.654140 | 0.448460 |
| Die Metallization Total | 0.125750 | 0.654140 | 0.448460 | |||
| Die Total | 19.223680 | 100.000000 | 68.558060 | |||
| Pre-Plating 1 | Pure metal layer | Copper (Cu) | 7440-50-8 | 0.014890 | 100.000000 | 0.053103 |
| Pre-Plating 1 Total | 0.014890 | 100.000000 | 0.053103 | |||
| Pre-Plating 2 | Pure metal layer | Nickel (Ni) | 7440-02-0 | 0.118050 | 100.000000 | 0.421006 |
| Pre-Plating 2 Total | 0.118050 | 100.000000 | 0.421006 | |||
| Pre-Plating 3 | Pure metal layer | Copper (Cu) | 7440-50-8 | 1.042790 | 100.000000 | 3.718937 |
| Pre-Plating 3 Total | 1.042790 | 100.000000 | 3.718937 | |||
| GAN3R2-100CBE Total | 28.040000 | 100.000000 | 100.000000 |
| Notes |
|---|
| Report created on 2024-12-18 14:36:25 CET+0100 |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights. |
| Pb-free Soldering | Pb Soldering | No. of Processing Cycles | ||
|---|---|---|---|---|
| PPT | MPPT | PPT | MPPT | |
| 260 °C | 40 s | 235 °C | 30 s | 3 |
| Notes |
|---|
| Report created on 2024-12-18 14:36:25 CET+0100 |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights. |
| 部件名称 Material |
有毒或有害物质和元素 (Toxic or hazardous substances and elements) | |||||
|---|---|---|---|---|---|---|
| 铅 (Pb) | 镉 (Cd) | 汞 (Hg) | 六价铬 (Cr6+) | 多溴联苯 (PBB) | 多溴二苯醚 (PBDE) | |
| 钝化层 (Passivation) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 焊锡凸块 (Solder Bump) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 焊锡凸块 (Solder Bump) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 底部金属层1 (Under Bump Metallization 1) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 底部金属层2 (Under Bump Metallization 2) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 半导体芯片 (Die) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 半导体芯片金属化层 (Die Metallization) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 预镀层1 (Pre-Plating 1) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 预镀层2 (Pre-Plating 2) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| 预镀层3 (Pre-Plating 3) | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ |
| ◯ | 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572. |
| ✕ | 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572. |
|
该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP). |
| Notes |
|---|
| Report created on 2024-12-18 14:36:25 CET+0100 |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights. |