Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content GAN3R2-100CBE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934665899341GAN3R2-100CBEAZGAN3R2-100CBESOT8072 (WLCSP8)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 872-50-4: 3 ppm; substance 7440-02-0: 4210 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 872-50-4: 3 ppm; substance 7440-02-0: 4210 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 35751 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
PassivationPolymerPolyimide resin0.42961090.3985401.532132
PassivationPolymerNon hazardous0.0455309.5804200.162381
PassivationImpurityN-Methylpyrrolidone (NMP)872-50-40.0001000.0210400.000351
Passivation Total0.475240100.0000001.694864
Solder Bump 2Tin solderSilver (Ag)7440-22-41.002470100.0000003.575143
Solder Bump Total1.002470100.0000003.575143
Solder Bump 2 Total1.002470100.0000003.575143
Solder Bump 1Tin solderTin (Sn)7440-31-50.315570100.0000001.125428
Solder Bump Total0.315570100.0000001.125428
Solder Bump 1 Total0.315570100.0000001.125428
Under Bump Metallization 1Pure metal layerTitanium (Ti)7440-32-65.699390100.00000020.325927
Under Bump Metallization 1 Total5.699390100.00000020.325927
Under Bump Metallization 2Pure metal layerCopper (Cu)7440-50-80.147920100.0000000.527532
Under Bump Metallization 2 Total0.147920100.0000000.527532
DieDoped siliconSilicon (Si)7440-21-318.92688098.45607067.499560
DieMetallisationGallium Nitride (GaN)25617-97-40.1710500.8897900.610040
DiePure metal layerAluminium (Al)7429-90-50.1257500.6541400.448460
Die Total19.223680100.00000068.558060
Pre-Plating 3Pure metal layerCopper (Cu)7440-50-81.042790100.0000003.718937
Pre-Plating Total1.042790100.0000003.718937
Pre-Plating 3 Total1.042790100.0000003.718937
Pre-Plating 2Pure metal layerNickel (Ni)7440-02-00.118050100.0000000.421006
Pre-Plating Total0.118050100.0000000.421006
Pre-Plating 2 Total0.118050100.0000000.421006
Pre-Plating 1Pure metal layerCopper (Cu)7440-50-80.014890100.0000000.053103
Pre-Plating Total0.014890100.0000000.053103
Pre-Plating 1 Total0.014890100.0000000.053103
GAN3R2-100CBE Total28.040000100.000000100.000000
Notes
Report created on 2024-10-26 17:48:36 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-10-26 17:48:36 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
钝化层 (Passivation)
焊锡凸块2 (Solder Bump 2)
焊锡凸块1 (Solder Bump 1)
底部金属层1 (Under Bump Metallization 1)
底部金属层2 (Under Bump Metallization 2)
半导体芯片 (Die)
预镀层1 (Pre-Plating 3)
预镀层1 (Pre-Plating 2)
预镀层1 (Pre-Plating 1)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-10-26 17:48:36 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.