Chemical content GAN7R0-150LBE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC	OPN	Type No.	Package	State	MSL
934665900328	GAN7R0-150LBEZ	GAN7R0-150LBE	SOT8073-1 (FCLGA)	RFS	3

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Contains intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 5694 ppm; substance 65997-17-3: 16360 ppm; substance 1333-86-4: 1248 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 5694 ppm; substance 1333-86-4: 1248 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-05-3: 387 ppm; substance 7440-57-5: 185 ppm; substance 7440-22-4: 25 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Passivation	Polymer	Polyimide resin		0.131020	94.000150	0.467252
Passivation	Additive	Non hazardous		0.008360	5.999850	0.029823
		Passivation Total		0.139380	100.000000	0.497075

Substrate/Laminate	Copper alloy	Copper (Cu)	7440-50-8	5.496710	73.393690	19.603104
Substrate/Laminate	Copper alloy	Phosphorus (P)	7723-14-0	0.001390	0.018560	0.004953
		Plating 2 Total		5.498100	73.412250	19.608057
Substrate/Laminate	Pure metal layer	Nickel (Ni)	7440-02-0	0.149640	1.998040	0.533674
		Plating 3 Total		0.149640	1.998040	0.533674
Substrate/Laminate	Pure metal layer	Palladium (Pd)	7440-05-3	0.010850	0.144870	0.038683
		Plating 4 Total		0.010850	0.144870	0.038683
Substrate/Laminate	Pure metal layer	Gold (Au)	7440-57-5	0.005200	0.069430	0.018544
		Plating 5 Total		0.005200	0.069430	0.018544
Substrate/Laminate	Filler	Silica -amorphous-	7631-86-9	0.688510	9.193190	2.455464
Substrate/Laminate	Filler	Glass Fibrous	65997-17-3	0.458740	6.125230	1.636024
Substrate/Laminate	Polymer	Epoxy resin system		0.228970	3.057270	0.816574
Substrate/Laminate	Polymer	Cyanate ester resin		0.152380	2.034620	0.543424
Substrate/Laminate	Impurity	Misc. Chlorine compounds (generic)		0.000480	0.006410	0.001713
Substrate/Laminate	Impurity	Misc. fluorine compounds (generic)		0.000130	0.001740	0.000483
		Pre-preg Total		1.529210	20.418460	5.453682
Substrate/Laminate	Polymer	Acrylate Polymer		0.130690	1.745010	0.466073
Substrate/Laminate	Filler	Barium sulphate	7727-43-7	0.086240	1.151500	0.307543
Substrate/Laminate	Polymer	Epoxy resin system		0.058080	0.775500	0.207143
Substrate/Laminate	Filler	Talc	14807-96-6	0.008890	0.118700	0.031714
Substrate/Laminate	Additive	Non hazardous		0.008890	0.118700	0.031714
Substrate/Laminate	Additive	Silicon dioxide	7631-86-9	0.001780	0.023770	0.006343
Substrate/Laminate	Pigment	C.I. Pigment Blue 15	147-14-8	0.001780	0.023770	0.006343
		Solder Mask Total		0.296350	3.956950	1.056873
		Substrate/Laminate Total		7.489350	100.000000	26.709513

Redistribution Layer	Pure metal layer	Copper (Cu)	7440-50-8	0.346900	100.000000	1.237161
		Redistribution Layer Total		0.346900	100.000000	1.237161

Solder Bump 1	Pure metal layer	Copper (Cu)	7440-50-8	0.452700	100.000000	1.614479
		Solder Bump 1 Total		0.452700	100.000000	1.614479

Solder Bump 2	Pure metal layer	Nickel (Ni)	7440-02-0	0.010030	100.000000	0.035770
		Solder Bump 2 Total		0.010030	100.000000	0.035770

Solder Bump 3	Tin alloy	Tin (Sn)	7440-31-5	0.038280	98.204210	0.136513
Solder Bump 3	Tin alloy	Silver (Ag)	7440-22-4	0.000700	1.795790	0.002503
		Solder Bump 3 Total		0.038980	100.000000	0.139016

Under Bump Metallization 1	Pure metal layer	Titanium (Ti)	7440-32-6	0.000030	100.000000	0.000107
		Under Bump Metallization 1 Total		0.000030	100.000000	0.000107

Under Bump Metallization 2	Pure metal layer	Copper (Cu)	7440-50-8	0.000310	100.000000	0.001106
		Under Bump Metallization 2 Total		0.000310	100.000000	0.001106

Underfill	Filler	Silica fused	60676-86-0	0.439380	64.597820	1.566967
Underfill	Polymer	Formaldehyde, polymer with (chloromethyl)oxirane and phenol	9003-36-5	0.213420	31.377820	0.761137
Underfill	Additive	Non hazardous		0.021760	3.199410	0.077607
Underfill	Pigment	Carbon black	1333-86-4	0.005440	0.799840	0.019397
Underfill	Impurity	Misc. Chlorine compounds (generic)		0.000130	0.019090	0.000457
Underfill	Additive	Polysiloxanes, Me 3,3,3-trifluoropropyl	63148-56-1	0.000040	0.006020	0.000147
		Underfill Total		0.680170	100.000000	2.425712

Die	Doped silicon	Silicon (Si)	7440-21-3	12.778950	98.545280	45.573992
Die	Metallisation	Gallium Nitride (GaN)	25617-97-4	0.103740	0.800000	0.369963
Die	Metallisation	Aluminium (Al)	7429-90-5	0.084900	0.654720	0.302783
		Die Total		12.967590	100.000000	46.246738

Mould Compound	Filler	Silica fused	60676-86-0	2.957280	50.000000	10.546658
Mould Compound	Filler	Silica -amorphous-	7631-86-9	1.774370	30.000000	6.327999
Mould Compound	Polymer	Epoxy resin system		0.975910	16.500000	3.480399
Mould Compound	Polymer	Phenolic resin		0.177440	3.000000	0.632799
Mould Compound	Pigment	Carbon black	1333-86-4	0.029570	0.500000	0.105468
		Mould Compound Total		5.914570	100.000000	21.093323

		GAN7R0-150LBE Total		28.040010	100.000000	100.000000

Notes
Report created on 2024-12-21 22:20:50 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2024-12-21 22:20:50 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
钝化层 (Passivation)	◯	◯	◯	◯	◯	◯
镀层2 (Plating 2)	◯	◯	◯	◯	◯	◯
镀层3 (Plating 3)	◯	◯	◯	◯	◯	◯
镀层4 (Plating 4)	◯	◯	◯	◯	◯	◯
镀层5 (Plating 5)	◯	◯	◯	◯	◯	◯
黏合胶片 (Pre-preg)	◯	◯	◯	◯	◯	◯
防焊绿漆 (Solder Mask)	◯	◯	◯	◯	◯	◯
重布层 (Redistribution Layer)	◯	◯	◯	◯	◯	◯
焊锡凸块1 (Solder Bump 1)	◯	◯	◯	◯	◯	◯
焊锡凸块2 (Solder Bump 2)	◯	◯	◯	◯	◯	◯
焊锡凸块3 (Solder Bump 3)	◯	◯	◯	◯	◯	◯
底部金属层1 (Under Bump Metallization 1)	◯	◯	◯	◯	◯	◯
底部金属层2 (Under Bump Metallization 2)	◯	◯	◯	◯	◯	◯
底部填充料 (Underfill)	◯	◯	◯	◯	◯	◯
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-12-21 22:20:50 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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Chemical content GAN7R0-150LBE

Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content GAN7R0-150LBE