Chemical content GANE3R9-150QBA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC	OPN	Type No.	Package	State	MSL
934667633332	GANE3R9-150QBAZ	GANE3R9-150QBA	SOT8091-1 (VQFN7)	RFS	3

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 5423 ppm; substance 7439-92-1: 1 ppm; substance 1333-86-4: 781 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 5423 ppm; substance 7439-92-1: 1 ppm; substance 1333-86-4: 781 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 48416 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Bump 1	Pure metal	Copper (Cu)	7440-50-8	0.008070	100.000000	0.014076
		Bump 1 Total		0.008070	100.000000	0.014076

Bump 2	Pure metal	Nickel (Ni)	7440-02-0	0.310910	100.000000	0.542316
		Bump 2 Total		0.310910	100.000000	0.542316

Bump 3	Pure metal	Silver (Ag)	7440-22-4	2.775680	100.000000	4.841584
		Bump 3 Total		2.775680	100.000000	4.841584

Bump 4	Pure metal	Tin (Sn)	7440-31-5	0.094760	100.000000	0.165289
		Bump 4 Total		0.094760	100.000000	0.165289

Passivation	Polymer	Polyimide resin		0.322000	100.000000	0.561661
		Passivation Total		0.322000	100.000000	0.561661

Terminal	Tin solder	Tin (Sn)	7440-31-5	1.109350	99.995000	1.935035
Terminal	Tin solder	Lead (Pb)	7439-92-1	0.000060	0.005000	0.000095
		Terminal Total		1.109410	100.000000	1.935130

Under Bump Metallization 1	Pure metal layer	Titanium (Ti)	7440-32-6	0.008330	100.000000	0.014530
		Under Bump Metallization 1 Total		0.008330	100.000000	0.014530

Under Bump Metallization 2	Pure metal layer	Copper (Cu)	7440-50-8	0.066020	100.000000	0.115158
		Under Bump Metallization 2 Total		0.066020	100.000000	0.115158

Die	Doped silicon	Silicon (Si)	7440-21-3	13.154170	98.456060	22.944655
Die	Metallisation	Gallium Nitride (GaN)	25617-97-4	0.118880	0.889810	0.207365
Die	Pure metal layer	Aluminium (Al)	7429-90-5	0.087400	0.654130	0.152445
		Die Metallization Total		0.087400	0.654130	0.152445
		Die Total		13.360450	100.000000	23.304465

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	29.557730	97.500000	51.557179
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.697260	2.300000	1.216219
Lead Frame	Copper alloy	Zinc (Zn)	7440-66-6	0.030320	0.100000	0.052879
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.030310	0.100000	0.052879
		Lead Frame Total		30.315620	100.000000	52.879156

Mould Compound	Filler	Silica fused	60676-86-0	7.167000	80.000000	12.501309
Mould Compound	Filler	Silica -amorphous-	7631-86-9	0.671910	7.500000	1.171999
Mould Compound	Polymer	Phenolic resin		0.430020	4.800000	0.750079
Mould Compound	Polymer	Epoxy resin system		0.430020	4.800000	0.750080
Mould Compound	Metal oxide	Flame retardant		0.215010	2.400000	0.375039
Mould Compound	Pigment	Carbon black	1333-86-4	0.044790	0.500000	0.078129
		Mould Compound Total		8.958750	100.000000	15.626635

		GANE3R9-150QBA Total		57.330000	100.000000	100.000000

Notes
Report created on 2024-12-21 22:20:50 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2024-12-21 22:20:50 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
凸块1 (Bump 1)	◯	◯	◯	◯	◯	◯
凸块2 (Bump 2)	◯	◯	◯	◯	◯	◯
凸块3 (Bump 3)	◯	◯	◯	◯	◯	◯
凸块4 (Bump 4)	◯	◯	◯	◯	◯	◯
钝化层 (Passivation)	◯	◯	◯	◯	◯	◯
端子 (Terminal)	◯	◯	◯	◯	◯	◯
底部金属层1 (Under Bump Metallization 1)	◯	◯	◯	◯	◯	◯
底部金属层2 (Under Bump Metallization 2)	◯	◯	◯	◯	◯	◯
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层 (Die Metallization)	◯	◯	◯	◯	◯	◯
引线框架 (Lead Frame)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-12-21 22:20:50 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

All products

Bipolar transistors

Diodes

ESD protection, TVS, signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive

All applications

Automotive

Industrial and Power

Mobile and Wearables

Computing and Consumer

Sub-systems: Power conversion topologies

Sub-systems: General

Reference designs

Evaluation boards

Interactive application notes

Advanced Support Tools

Chemical content GANE3R9-150QBA

Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content GANE3R9-150QBA