Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content MMBZ33VST-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
MMBZ33VST-QSOT23TO-236AB7.77753 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346659552352126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07000100.000000.90003
subTotal0.07000100.000000.90003
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002350.080000.03024
Carbon (C)7440-44-00.001180.040000.01512
Chromium (Cr)7440-47-30.006170.210000.07938
Cobalt (Co)7440-48-40.012350.420000.15877
Iron (Fe)7439-89-61.3818047.0000017.76657
Manganese (Mn)7439-96-50.024700.840000.31753
Nickel (Ni)7440-02-01.0410535.4100013.38541
Phosphorus (P)7723-14-00.000590.020000.00756
Silicon (Si)7440-21-30.007350.250000.09450
Sulphur (S)7704-34-90.000590.020000.00756
Pure metal layerCopper (Cu)7440-50-80.3822013.000004.91416
Silver (Ag)7440-22-40.079672.710001.02441
subTotal2.94000100.0000037.80121
Mould CompoundAdditiveNon hazardousProprietary0.132472.900001.70327
Triphenylphosphine603-35-00.002280.050000.02937
FillerSilica -amorphous-7631-86-93.2889672.0000042.28798
PigmentCarbon black1333-86-40.002280.050000.02937
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.6852015.000008.80999
Phenol Formaldehyde resin (generic)9003-35-40.4568010.000005.87333
subTotal4.56800100.0000058.73331
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000110.055500.00136
Tin solderTin (Sn)7440-31-50.1898999.940002.44147
subTotal0.19000100.000002.44294
WirePure metalCopper (Cu)7440-50-80.00953100.000000.12256
subTotal0.00953100.000000.12256
total7.77753100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.