Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NBM5100BBQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NBM5100BBQSOT763-1DHVQFN1621.83001 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356911941154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00457
FillerSilver (Ag)7440-22-40.0747675.000000.34246
PolymerAcrylic resinProprietary0.005986.000000.02740
Resin systemProprietary0.0179418.000000.08219
subTotal0.09968100.000000.45662
DieDoped siliconSilicon (Si)7440-21-30.75553100.000003.46095
subTotal0.75553100.000003.46095
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.84641
Iron (Fe)7439-89-60.198062.400000.90727
Phosphorus (P)7723-14-00.002480.030000.01134
Zinc (Zn)7440-66-60.008250.100000.03780
subTotal8.25236100.0000037.80282
Mould CompoundAdditiveNon hazardousProprietary0.371162.984001.70024
FillerSilica -amorphous-7631-86-90.434103.490001.98856
Silica fused60676-86-010.5503084.8200048.32935
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.124631.002000.57093
PigmentCarbon black1333-86-40.020400.164000.09345
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.460353.701002.10878
Epoxy resin systemProprietary0.197271.586000.90368
Phenolic resinProprietary0.280242.253001.28373
subTotal12.43846100.0000056.97872
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00960
Nickel (Ni)7440-02-00.1906391.000000.87323
Palladium (Pd)7440-05-30.016768.000000.07677
subTotal0.20948100.000000.95960
WirePure metalCopper (Cu)7440-50-80.0719396.550000.32950
Pure metal layerGold (Au)7440-57-50.000260.350000.00119
Palladium (Pd)7440-05-30.002313.100000.01058
subTotal0.07450100.000000.34127
total21.83001100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.