Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NGW75T65H3DF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NGW75T65H3DFSOT429-2TO247-3L6034.63822 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346655041275130 sNA20 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-35.60000100.000000.09280
subTotal5.60000100.000000.09280
DieDoped siliconSilicon (Si)7440-21-315.15000100.000000.25105
subTotal15.15000100.000000.25105
Lead FrameCopper alloyCopper (Cu)7440-50-84034.5916099.8784966.85722
Iron (Fe)7439-89-62.827650.070000.04686
Phosphorus (P)7723-14-01.211850.030000.02008
ImpurityLead (Pb)7439-92-10.061000.001510.00101
Non hazardousProprietary0.008080.000200.00013
Pure metal layerNickel (Ni)7440-02-00.799820.019800.01325
subTotal4039.50000100.0000066.93855
Mould CompoundAdditiveNon hazardousProprietary57.807303.000000.95792
FillerSilica fused60676-86-01646.5446085.4500027.28489
HardenerPhenolic resinProprietary57.807303.000000.95792
PigmentCarbon black1333-86-410.598000.550000.17562
PolymerEpoxy resin systemProprietary144.518257.500002.39481
subTotal1926.91000100.0000031.77116
Post-PlatingImpurityNon hazardousProprietary0.002950.010000.00005
Tin solderTin (Sn)7440-31-529.5270599.990000.48929
subTotal29.53000100.000000.48934
Solder WireLead alloyLead (Pb)7439-92-10.9350093.500000.01549
Silver (Ag)7440-22-40.015001.500000.00025
Tin (Sn)7440-31-50.050005.000000.00083
subTotal1.00000100.000000.01657
WireImpurityCopper (Cu)7440-50-80.000000.001000.00000
Iron (Fe)7439-89-60.000000.001000.00000
Magnesium (Mg)7439-95-40.000000.001000.00000
Nickel (Ni)7440-02-00.000010.006000.00000
Silicon (Si)7440-21-30.000000.001000.00000
Pure metalAluminium (Al)7429-90-50.1889299.990000.00313
subTotal0.18894100.000000.00313
WireImpurityCopper (Cu)7440-50-80.000170.001000.00000
Iron (Fe)7439-89-60.000170.001000.00000
Magnesium (Mg)7439-95-40.000170.001000.00000
Nickel (Ni)7440-02-00.001010.006000.00002
Silicon (Si)7440-21-30.000170.001000.00000
Pure metalAluminium (Al)7429-90-516.7576199.990000.27769
subTotal16.75928100.000000.27771
total6034.63822100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.