Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NPS3102AGB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NPS3102AGBSOT8037-1WDFN1025.54277 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356915051183126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.2700045.000001.05705
PolymerAcrylic resinProprietary0.0900015.000000.35235
Phenolic resinProprietary0.0900015.000000.35235
Resin systemProprietary0.1500025.000000.58725
subTotal0.60000100.000002.34900
DieDoped siliconSilicon (Si)7440-21-31.07227100.000004.19792
subTotal1.07227100.000004.19792
Lead FrameCopper alloyCopper (Cu)7440-50-88.9265897.0280034.94756
Iron (Fe)7439-89-60.191642.083000.75026
Phosphorus (P)7723-14-00.001380.015000.00540
Zinc (Zn)7440-66-60.004600.050000.01801
ImpurityLead (Pb)7439-92-10.000090.001000.00036
Pure metal layerGold (Au)7440-57-50.000920.010000.00360
Nickel (Ni)7440-02-00.072960.793000.28562
Palladium (Pd)7440-05-30.001840.020000.00720
subTotal9.20000100.0000036.01801
Mould CompoundFillerSilica -amorphous-7631-86-90.973007.000003.80930
Silica fused60676-86-011.5370083.0000045.16738
PigmentCarbon black1333-86-40.069500.500000.27209
PolymerEpoxy resin systemProprietary0.834006.000003.26511
Phenolic resinProprietary0.486503.500001.90465
subTotal13.90000100.0000054.41853
Pre-PlatingPure metal layerGold (Au)7440-57-50.001001.000000.00392
Nickel (Ni)7440-02-00.0970097.000000.37976
Palladium (Pd)7440-05-30.002002.000000.00783
subTotal0.10000100.000000.39151
WireImpurityNon hazardousProprietary0.000670.100000.00263
Pure metalCopper (Cu)7440-50-80.6463696.400002.53051
Pure metal layerGold (Au)7440-57-50.003350.500000.01313
Palladium (Pd)7440-05-30.020123.000000.07875
subTotal0.67050100.000002.62502
total25.54277100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.