Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NSF040120L3A0

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934665927127NSF040120L3A0QNSF040120L3A0SOT429-2 (TO247-3L)RFSNone
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 1622 ppm of the article. SCIP No. 72cff671-3be6-4935-9b41-015f709bf43a.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 1622 ppm; substance 7440-02-0: 133 ppm; substance 1333-86-4: 1761 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 1622 ppm; substance 7440-02-0: 133 ppm; substance 1333-86-4: 1761 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 26 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator HEU RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
Chip CoatPolymer3-Aminopropyltrihydroxysilane58160-99-90.000010100.0000000.000000
Chip Coat Total0.000010100.0000000.000000
Solder WireLead alloyLead (Pb)7439-92-19.70530093.5000000.161284
Solder WireLead alloyTin (Sn)7440-31-50.5190005.0000000.008625
Solder WireLead alloySilver (Ag)7440-22-40.1557001.5000000.002587
Solder Wire Total10.380000100.0000000.172496
DieDoped silicon carbideSilicon Carbide (SiC)409-21-21.727000100.0000000.028699
Die Total1.727000100.0000000.028699
Lead FrameCopper alloyCopper (Cu)7440-50-84034.59160499.87849067.047200
Lead FrameCopper alloyIron (Fe)7439-89-62.8276500.0700000.046990
Lead FrameCopper alloyPhosphorus (P)7723-14-01.2118500.0300000.020139
Lead FrameImpurityLead (Pb)7439-92-10.0609960.0015100.001015
Lead FrameImpurityNon hazardous0.0080790.0002000.000134
Lead FramePure metal layerNickel (Ni)7440-02-00.7998210.0198000.013291
Lead Frame Total4039.500000100.00000067.128769
Mould CompoundFillerSilica fused60676-86-01646.54459585.45000027.362424
Mould CompoundPolymerEpoxy resin system144.5182507.5000002.401617
Mould CompoundHardenerPhenolic resin57.8073003.0000000.960647
Mould CompoundAdditiveNon hazardous57.8073003.0000000.960647
Mould CompoundPigmentCarbon black1333-86-410.5980050.5500000.176119
Mould CompoundAdditiveNon hazardous9.6345500.5000000.160107
Mould Compound Total1926.910000100.00000032.021561
Post-PlatingTin solderTin (Sn)7440-31-529.52704799.9900000.490683
Post-PlatingImpurityNon hazardous0.0029530.0100000.000049
Post-Plating Total29.530000100.0000000.490732
Wire 2Pure metalAluminium (Al)7429-90-59.27854299.9900000.154192
Wire 2ImpurityNickel (Ni)7440-02-00.0005570.0060000.000009
Wire 2ImpurityIron (Fe)7439-89-60.0000930.0010000.000001
Wire 2ImpuritySilicon (Si)7440-21-30.0000930.0010000.000002
Wire 2ImpurityMagnesium (Mg)7439-95-40.0000930.0010000.000002
Wire 2ImpurityCopper (Cu)7440-50-80.0000920.0010000.000001
Wire Total9.279470100.0000000.154207
Wire 2 Total9.279470100.0000000.154207
Wire 1Pure metalAluminium (Al)7429-90-50.21274999.9900000.003535
Wire 1ImpurityNickel (Ni)7440-02-00.0000130.0060000.000000
Wire 1ImpurityIron (Fe)7439-89-60.0000030.0010000.000001
Wire 1ImpuritySilicon (Si)7440-21-30.0000020.0010000.000000
Wire 1ImpurityCopper (Cu)7440-50-80.0000020.0010000.000000
Wire 1ImpurityMagnesium (Mg)7439-95-40.0000020.0010000.000000
Wire Total0.212771100.0000000.003536
Wire 1 Total0.212771100.0000000.003536
NSF040120L3A0 Total6017.539251100.000000100.000000
Notes
Report created on 2024-10-26 17:49:11 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
芯片涂层 (Chip Coat)
焊锡丝 (Solder Wire)
半导体芯片 (Die)
引线框架 (Lead Frame)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线2 (Wire 2)
导线1 (Wire 1)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-10-26 17:49:11 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.