Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NSF080120D7A0

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NSF080120D7A0SOT8070-1TO263-7L1504.41475 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346673911183126030 s123520 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped silicon carbideSilicon Carbide (SiC)409-21-22.24000100.000000.14890
subTotal2.24000100.000000.14890
Lead FrameCopper alloyCopper (Cu)7440-50-8859.7851399.8589057.15080
Iron (Fe)7439-89-60.706880.082100.04699
Phosphorus (P)7723-14-00.223860.026000.01488
Nickel alloyNickel (Ni)7440-02-00.086100.010000.00572
Phosphorus (P)7723-14-00.120540.014000.00801
Pure metal layerNickel (Ni)7440-02-00.077490.009000.00515
subTotal861.00000100.0000057.23155
Mould CompoundFillerSilica -amorphous-7631-86-992.1885015.000006.12786
Silica fused60676-86-0460.9425075.0000030.63932
PigmentCarbon black1333-86-43.072950.500000.20426
PolymerEpoxy resin systemProprietary46.094257.500003.06393
Phenolic resinProprietary12.291802.000000.81705
subTotal614.59000100.0000040.85242
Post-PlatingImpurityNon hazardousProprietary0.001430.010000.00010
Tin solderTin (Sn)7440-31-514.2985799.990000.95044
subTotal14.30000100.000000.95054
Solder WireLead alloyLead (Pb)7439-92-15.3295093.500000.35426
Silver (Ag)7440-22-40.085501.500000.00568
Tin (Sn)7440-31-50.285005.000000.01894
subTotal5.70000100.000000.37888
WireImpurityCopper (Cu)7440-50-80.000000.001000.00000
Iron (Fe)7439-89-60.000000.001000.00000
Magnesium (Mg)7439-95-40.000000.001000.00000
Nickel (Ni)7440-02-00.000020.006000.00000
Silicon (Si)7440-21-30.000000.001000.00000
Pure metalAluminium (Al)7429-90-50.2941599.990000.01955
subTotal0.29418100.000000.01955
WireImpurityCopper (Cu)7440-50-80.000060.001000.00000
Iron (Fe)7439-89-60.000060.001000.00000
Magnesium (Mg)7439-95-40.000060.001000.00000
Nickel (Ni)7440-02-00.000380.006000.00003
Silicon (Si)7440-21-30.000060.001000.00000
Pure metalAluminium (Al)7429-90-56.2899499.990000.41810
subTotal6.29057100.000000.41813
total1504.41475100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.