Chemical content NX2301P

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC	OPN	Type No.	Package	State	MSL
934064624235	NX2301PVL	NX2301P	SOT23 (TO-236AB)	RFS	1
934064624215	NX2301P,215	NX2301P	SOT23 (TO-236AB)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 123879 ppm; substance 7440-48-4: 1473 ppm; substance 1333-86-4: 304 ppm; substance 7439-92-1: 1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 123879 ppm; substance 7440-48-4: 1473 ppm; substance 1333-86-4: 304 ppm; substance 7439-92-1: 1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-57-5: 1456 ppm; substance 7440-22-4: 8809 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	0.164448	91.360000	2.059519
Die	Pure metal layer	Aluminium (Al)	7429-90-5	0.003924	2.180000	0.049144
		Die Metallization 1 Total		0.003924	2.180000	0.049144
Die	Pure metal layer	Gold (Au)	7440-57-5	0.011628	6.460000	0.145627
		Die Metallization 2 Total		0.011628	6.460000	0.145627
		Die Total		0.180000	100.000000	2.254290

Lead Frame	Iron-nickel alloy	Iron (Fe)	7439-89-6	1.313213	47.980000	16.446454
Lead Frame	Iron-nickel alloy	Nickel (Ni)	7440-02-0	0.989152	36.140000	12.387971
Lead Frame	Iron-nickel alloy	Manganese (Mn)	7439-96-5	0.023538	0.860000	0.294788
Lead Frame	Iron-nickel alloy	Cobalt (Co)	7440-48-4	0.011769	0.430000	0.147394
Lead Frame	Iron-nickel alloy	Silicon (Si)	7440-21-3	0.007117	0.260000	0.089121
Lead Frame	Iron-nickel alloy	Chromium (Cr)	7440-47-3	0.006021	0.220000	0.075410
Lead Frame	Iron-nickel alloy	Aluminium (Al)	7429-90-5	0.002463	0.090000	0.030850
Lead Frame	Iron-nickel alloy	Carbon (C)	7440-44-0	0.001095	0.040000	0.013710
Lead Frame	Iron-nickel alloy	Phosphorus (P)	7723-14-0	0.000547	0.020000	0.006856
Lead Frame	Iron-nickel alloy	Sulfur (S)	7704-34-9	0.000547	0.020000	0.006856
		Base Alloy Total		2.355462	86.060000	29.499410
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.070341	2.570000	0.880938
		Pre-Plating 1 Total		0.070341	2.570000	0.880938
Lead Frame	Pure metal layer	Copper (Cu)	7440-50-8	0.311197	11.370000	3.897378
		Pre-Plating 2 Total		0.311197	11.370000	3.897378
		Lead Frame Total		2.737000	100.000000	34.277726

Mould Compound	Filler	Silica	7631-86-9	3.502800	72.000000	43.868478
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	0.729750	15.000000	9.139266
Mould Compound	Polymer	Formaldehyde-phenol copolymer	9003-35-4	0.486500	10.000000	6.092843
Mould Compound	Additive	Non-declarable		0.141084	2.900000	1.766924
Mould Compound	Pigment	Carbon black	1333-86-4	0.002433	0.050000	0.030464
Mould Compound	Additive	Triphenylphosphine	603-35-0	0.002433	0.050000	0.030464
		Mould Compound Total		4.865000	100.000000	60.928439

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.189886	99.940000	2.378100
Post-Plating	Impurity	Non-declarable		0.000105	0.055500	0.001321
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000009	0.004500	0.000107
		Post-Plating Total		0.190000	100.000000	2.379528

Wire	Pure metal	Copper (Cu)	7440-50-8	0.012777	100.000000	0.160017
		Wire Total		0.012777	100.000000	0.160017

		NX2301P Total		7.984777	100.000000	100.000000

Notes
Report created on 2024-12-18 14:36:48 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2024-12-18 14:36:48 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层1 (Die Metallization 1)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层2 (Die Metallization 2)	◯	◯	◯	◯	◯	◯
基底合金 (Base Alloy)	◯	◯	◯	◯	◯	◯
预镀层1 (Pre-Plating 1)	◯	◯	◯	◯	◯	◯
预镀层2 (Pre-Plating 2)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯
后镀层 (Post-Plating)	◯	◯	◯	◯	◯	◯
导线 (Wire)	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-12-18 14:36:48 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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Chemical content NX2301P

Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NX2301P