Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NXB0106BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NXB0106BQSOT763-1DHVQFN1622.13839 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356915291153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13551
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09023
subTotal0.05000100.000000.22583
DieDoped siliconSilicon (Si)7440-21-31.13662100.000005.13414
subTotal1.13662100.000005.13414
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.33315
Iron (Fe)7439-89-60.198062.400000.89463
Phosphorus (P)7723-14-00.002480.030000.01118
Zinc (Zn)7440-66-60.008250.100000.03728
subTotal8.25236100.0000037.27624
Mould CompoundAdditiveNon hazardousProprietary0.371162.984001.67656
FillerSilica -amorphous-7631-86-90.434103.490001.96086
Silica fused60676-86-010.5503084.8200047.65614
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.124631.002000.56297
PigmentCarbon black1333-86-40.020400.164000.09214
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.460353.701002.07941
Epoxy resin systemProprietary0.197271.586000.89109
Phenolic resinProprietary0.280242.253001.26585
subTotal12.43846100.0000056.18502
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00946
Nickel (Ni)7440-02-00.1906391.000000.86107
Palladium (Pd)7440-05-30.016768.000000.07570
subTotal0.20948100.000000.94623
WirePure metalCopper (Cu)7440-50-80.0497096.550000.22451
Pure metal layerGold (Au)7440-57-50.000180.350000.00081
Palladium (Pd)7440-05-30.001603.100000.00721
subTotal0.05148100.000000.23253
total22.13839100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.