Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NXU0104BZ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NXU0104BZSOT8014-1DHXQFN145.625228 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356918651473126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.00670860.0000000.119248
ImpurityNon hazardousProprietary0.0000040.0395000.000079
PolymerResin systemProprietary0.00446739.9514100.079402
subTotal0.011180100.0000000.198729
DieDoped siliconSilicon (Si)7440-21-30.162979100.0000002.897284
subTotal0.162979100.0000002.897284
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.69450597.00000047.900366
Nickel (Ni)7440-02-00.0833353.0000001.481455
subTotal2.777840100.00000049.381821
Mould CompoundAdditiveNon hazardousProprietary0.0783502.9840001.392827
FillerSilica -amorphous-7631-86-90.0916363.4900001.629010
Silica fused60676-86-02.22708584.82000039.591014
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.0263091.0020000.467699
PigmentCarbon black1333-86-40.0043060.1640000.076549
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.0971763.7010001.727498
Epoxy resin systemProprietary0.0416431.5860000.740289
Phenolic resinProprietary0.0591562.2530001.051622
subTotal2.625660100.00000046.676508
Pre-PlatingPure metal layerGold (Au)7440-57-50.0001371.0000000.002439
Nickel (Ni)7440-02-00.01248591.0000000.221950
Palladium (Pd)7440-05-30.0010988.0000000.019512
subTotal0.013720100.0000000.243901
WirePure metalCopper (Cu)7440-50-80.03268196.5500000.580979
Pure metal layerGold (Au)7440-57-50.0001180.3500000.002106
Palladium (Pd)7440-05-30.0010493.1000000.018654
subTotal0.033849100.0000000.601739
total5.625228100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.