Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NXU0204BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NXU0204BQSOT762-1DHVQFN1418.105927 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356918551153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001285
FillerSilver (Ag)7440-22-40.01744575.0000000.096350
PolymerAcrylic resinProprietary0.0013966.0000000.007708
Resin systemProprietary0.00418718.0000000.023124
subTotal0.023260100.0000000.128466
DieDoped siliconSilicon (Si)7440-21-30.362175100.0000002.000313
subTotal0.362175100.0000002.000313
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.80297297.47000037.573178
Iron (Fe)7439-89-60.1675092.4000000.925163
Phosphorus (P)7723-14-00.0020940.0300000.011565
Zinc (Zn)7440-66-60.0069800.1000000.038548
subTotal6.979555100.00000038.548454
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.733779
FillerSilica -amorphous-7631-86-90.3671483.4900002.027778
Silica fused60676-86-08.92306484.82000049.282558
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054101.0020000.582187
PigmentCarbon black1333-86-40.0172530.1640000.095288
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893453.7010002.150374
Epoxy resin systemProprietary0.1668471.5860000.921506
Phenolic resinProprietary0.2370162.2530001.309050
subTotal10.520000100.00000058.102521
Pre-PlatingPure metal layerGold (Au)7440-57-50.0017721.0000000.009786
Nickel (Ni)7440-02-00.16123091.0000000.890483
Palladium (Pd)7440-05-30.0141748.0000000.078284
subTotal0.177176100.0000000.978552
WirePure metalCopper (Cu)7440-50-80.04225196.5500000.233357
Pure metal layerGold (Au)7440-57-50.0001530.3500000.000846
Palladium (Pd)7440-05-30.0013573.1000000.007493
subTotal0.043761100.0000000.241695
total18.105927100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.