Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS4350PAS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS4350PAS-QSOT1061DHUSON37.63660 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346676591152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01440
FillerSilver (Ag)7440-22-40.0924084.000001.20996
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.14404
Isobornyl Methacrylate7534-94-30.005505.000000.07202
subTotal0.11000100.000001.44042
DieDoped siliconSilicon (Si)7440-21-30.28500100.000003.73203
subTotal0.28500100.000003.73203
Lead FrameCopper alloyCopper (Cu)7440-50-82.6312793.8400034.45609
Magnesium (Mg)7439-95-40.014020.500000.18359
Nickel (Ni)7440-02-00.103753.700001.35856
Silicon (Si)7440-21-30.022430.800000.29374
Pure metal layerGold (Au)7440-57-50.001680.060000.02203
Nickel (Ni)7440-02-00.028041.000000.36718
Palladium (Pd)7440-05-30.002800.100000.03672
subTotal2.80400100.0000036.71791
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.22871
FillerSilica -amorphous-7631-86-90.012350.290000.16177
Silica fused60676-86-03.6699986.1500048.05791
HardenerPhenolic resinProprietary0.182754.290002.39313
PigmentCarbon black1333-86-40.008090.190000.10599
PolymerEpoxy resin systemProprietary0.369348.670004.83647
subTotal4.26000100.0000055.78398
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00124
Tin solderTin (Sn)7440-31-50.1699099.940002.22479
subTotal0.17000100.000002.22613
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0076499.990000.10003
subTotal0.00764100.000000.10004
total7.63660100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.