Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS5250PAS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS5250PAS-QSOT1061DHUSON37.64650 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346676571152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01439
FillerSilver (Ag)7440-22-40.0924084.000001.20840
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.14386
Isobornyl Methacrylate7534-94-30.005505.000000.07193
subTotal0.11000100.000001.43858
DieDoped siliconSilicon (Si)7440-21-30.28500100.000003.72720
subTotal0.28500100.000003.72720
Lead FrameCopper alloyCopper (Cu)7440-50-82.6312793.8400034.41148
Magnesium (Mg)7439-95-40.014020.500000.18335
Nickel (Ni)7440-02-00.103753.700001.35680
Silicon (Si)7440-21-30.022430.800000.29336
Pure metal layerGold (Au)7440-57-50.001680.060000.02200
Nickel (Ni)7440-02-00.028041.000000.36670
Palladium (Pd)7440-05-30.002800.100000.03667
subTotal2.80400100.0000036.67036
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.22842
FillerSilica -amorphous-7631-86-90.012350.290000.16156
Silica fused60676-86-03.6699986.1500047.99568
HardenerPhenolic resinProprietary0.182754.290002.39003
PigmentCarbon black1333-86-40.008090.190000.10585
PolymerEpoxy resin systemProprietary0.369348.670004.83021
subTotal4.26000100.0000055.71175
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00123
Tin solderTin (Sn)7440-31-50.1699099.940002.22191
subTotal0.17000100.000002.22324
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0175099.990000.22884
subTotal0.01750100.000000.22886
total7.64650100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.