Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD24VF1BL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD24VF1BLSOD882DFN1006-20.933965 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340680253032126030 s123520 s3
9340680253154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.813735
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.112103
Phenolic resinProprietary0.00135313.5300000.144866
subTotal0.010000100.0000001.070704
DieDoped siliconSilicon (Si)7440-21-30.040000100.0000004.282816
subTotal0.040000100.0000004.282816
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.480034
Magnesium (Mg)7439-95-40.0008200.2000000.087798
Nickel (Ni)7440-02-00.0129153.1500001.382814
Silicon (Si)7440-21-30.0028290.6900000.302902
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013170
Nickel (Ni)7440-02-00.0052071.2700000.557516
Palladium (Pd)7440-05-30.0006970.1700000.074628
subTotal0.410000100.00000043.898861
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.081786
Silica fused60676-86-00.27000060.00000028.909006
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.445450
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.240908
PigmentCarbon black1333-86-40.0022500.5000000.240908
PolymerEpoxy resin systemProprietary0.0315007.0000003.372717
Phenolic resinProprietary0.0270006.0000002.890901
subTotal0.450000100.00000048.181677
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000096
Non hazardousProprietary0.0000110.0555000.001188
Tin solderTin (Sn)7440-31-50.01998899.9400002.140123
subTotal0.020000100.0000002.141408
WireImpurityNon hazardousProprietary0.0000000.0100000.000042
Pure metalGold (Au)7440-57-50.00396599.9900000.424492
subTotal0.003965100.0000000.424534
total0.933965100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.