Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD2CANFD27UU-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD2CANFD27UU-QSOT323SC-705.521730 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346659321151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.094000100.0000001.702365
subTotal0.094000100.0000001.702365
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016600.0900000.030056
Carbon (C)7440-44-00.0007380.0400000.013358
Chromium (Cr)7440-47-30.0016600.0900000.030056
Cobalt (Co)7440-48-40.0079290.4300000.143600
Iron (Fe)7439-89-60.81965844.45000014.844225
Manganese (Mn)7439-96-50.0127240.6900000.230428
Nickel (Ni)7440-02-00.63415234.39000011.484654
Phosphorus (P)7723-14-00.0003690.0200000.006679
Silicon (Si)7440-21-30.0047940.2600000.086828
Sulphur (S)7704-34-90.0003690.0200000.006679
Pure metal layerCopper (Cu)7440-50-80.32030317.3700005.800769
Silver (Ag)7440-22-40.0396462.1500000.718000
subTotal1.844000100.00000033.395331
Mould CompoundAdditiveNon hazardousProprietary0.0977302.9000001.769916
Triphenylphosphine603-35-00.0016850.0500000.030516
FillerSilica -amorphous-7631-86-92.42640072.00000043.942750
PigmentCarbon black1333-86-40.0016850.0500000.030516
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.50550015.0000009.154740
Phenol Formaldehyde resin (generic)9003-35-40.33700010.0000006.103160
subTotal3.370000100.00000061.031597
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000060.0030000.000114
Bismuth (Bi)7440-69-90.0000020.0010000.000038
Copper (Cu)7440-50-80.0000020.0010000.000038
Lead (Pb)7439-92-10.0000100.0050000.000190
Tin solderTin (Sn)7440-31-50.20997999.9900003.802776
subTotal0.210000100.0000003.803156
WirePure metalCopper (Cu)7440-50-80.003725100.0000000.067461
subTotal0.003725100.0000000.067461
total5.521730100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.