Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD2CANFD36VQB-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD2CANFD36VQB-QSOT8015DFN1110D-31.640534 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665548147312601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00532076.0000000.324285
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00073310.4700000.044674
Phenolic resinProprietary0.00094713.5300000.057731
subTotal0.007000100.0000000.426690
DieDoped siliconSilicon (Si)7440-21-30.070000100.0000004.266903
subTotal0.070000100.0000004.266903
Lead FrameCopper alloyCopper (Cu)7440-50-80.71880795.58600043.815411
Magnesium (Mg)7439-95-40.0011200.1490000.068300
Nickel (Ni)7440-02-00.0224162.9809001.366407
Silicon (Si)7440-21-30.0048570.6459000.296072
Pure metal layerGold (Au)7440-57-50.0000580.0077000.003530
Nickel (Ni)7440-02-00.0044670.5940000.272282
Palladium (Pd)7440-05-30.0002740.0365000.016731
subTotal0.752000100.00000045.838733
Mould CompoundFillerSilica -amorphous-7631-86-90.0600107.9800003.657931
Silica fused60676-86-00.60229280.09200036.713158
PigmentCarbon black1333-86-40.0069790.9280000.425383
PolymerEpoxy resin systemProprietary0.0635448.4500003.873373
Phenolic resinProprietary0.0191762.5500001.168888
subTotal0.752000100.00000045.838733
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000156
Non hazardousProprietary0.0000320.0555000.001928
Tin solderTin (Sn)7440-31-50.05696699.9400003.472394
subTotal0.057000100.0000003.474478
WireImpurityNon hazardousProprietary0.0000000.0100000.000015
Pure metalCopper (Cu)7440-50-80.00253499.9900000.154477
subTotal0.002535100.0000000.154492
total1.640534100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.