Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD33VL1BL-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD33VL1BL-QSOD882DFN1006-20.938313 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346663433152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.809964
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.111583
Phenolic resinProprietary0.00135313.5300000.144195
subTotal0.010000100.0000001.065742
DieDoped siliconSilicon (Si)7440-21-30.043000100.0000004.582693
subTotal0.043000100.0000004.582693
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.287822
Magnesium (Mg)7439-95-40.0008200.2000000.087391
Nickel (Ni)7440-02-00.0129153.1500001.376406
Silicon (Si)7440-21-30.0028290.6900000.301499
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013109
Nickel (Ni)7440-02-00.0052071.2700000.554932
Palladium (Pd)7440-05-30.0006970.1700000.074282
subTotal0.410000100.00000043.695441
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.030434
Silica fused60676-86-00.27000060.00000028.775046
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.438752
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.239792
PigmentCarbon black1333-86-40.0022500.5000000.239792
PolymerEpoxy resin systemProprietary0.0315007.0000003.357089
Phenolic resinProprietary0.0270006.0000002.877505
subTotal0.450000100.00000047.958410
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000096
Non hazardousProprietary0.0000110.0555000.001183
Tin solderTin (Sn)7440-31-50.01998899.9400002.130206
subTotal0.020000100.0000002.131485
WireImpurityNon hazardousProprietary0.0000010.0100000.000057
Pure metalGold (Au)7440-57-50.00531299.9900000.566172
subTotal0.005313100.0000000.566229
total0.938313100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.