Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD4USB3BBTBR-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD4USB3BBTBR-QSOT1176-2XSON103.094686 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346650664715126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveActive agent2-Phenyl-4,5-bis(hydroxymethyl)imidazole61698-32-60.0025005.0000000.080784
FillerSilica -amorphous-7631-86-90.03000060.0000000.969404
PolymerBisphenol A-epichlorohydrin resin25068-38-60.01000020.0000000.323135
Phenol, polymer with 3a,4,7,7a-tetrahydro-4,7-methano-1H-indene, glycidyl ether119345-05-00.00750015.0000000.242351
subTotal0.050000100.0000001.615673
DieDoped siliconSilicon (Si)7440-21-30.079000100.0000002.552763
subTotal0.079000100.0000002.552763
Lead FrameCopper alloyCopper (Cu)7440-50-80.89860594.59000029.037033
Magnesium (Mg)7439-95-40.0016150.1700000.052186
Nickel (Ni)7440-02-00.0410404.3200001.326144
Silicon (Si)7440-21-30.0067450.7100000.217954
Pure metal layerGold (Au)7440-57-50.0002850.0300000.009209
Nickel (Ni)7440-02-00.0010450.1100000.033768
Palladium (Pd)7440-05-30.0004750.0500000.015349
Silver (Ag)7440-22-40.0001900.0200000.006140
subTotal0.950000100.00000030.697783
Mould CompoundFillerSilica -amorphous-7631-86-90.1400007.0000004.523884
Silica fused60676-86-01.66000083.00000053.640337
PigmentCarbon black1333-86-40.0100000.5000000.323135
PolymerEpoxy resin systemProprietary0.1200006.0000003.877615
Phenolic resinProprietary0.0700003.5000002.261942
subTotal2.000000100.00000064.626912
WireImpurityNon hazardousProprietary0.0000000.0000500.000000
Silver (Ag)7440-22-40.0000000.0014500.000007
Pure metalCopper (Cu)7440-50-80.01514596.5485500.489375
Pure metal layerGold (Au)7440-57-50.0000710.4499600.002281
Palladium (Pd)7440-05-30.0004712.9997000.015205
subTotal0.015686100.0000000.506867
total3.094686100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.