Chemical content PHDMI2FC4

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC	OPN	Type No.	Package	State	MSL
934667819515	PHDMI2FC4Z	PHDMI2FC4	SOT1165-3 (XSON10)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 42 ppm; substance 1333-86-4: 2394 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 42 ppm; substance 1333-86-4: 2394 ppm; substance 7440-43-9: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 4176 ppm; substance 7440-05-3: 17 ppm; substance 7440-57-5: 2 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silica	7631-86-9	0.016800	60.000000	0.402561
Adhesive	Polymer	Resin system		0.011186	39.951410	0.268048
Adhesive	Impurity	Non-declarable		0.000011	0.039500	0.000265
Adhesive	Impurity	Non-declarable		0.000003	0.009090	0.000061
		Adhesive Total		0.028000	100.000000	0.670935

Die	Doped silicon	Silicon (Si)	7440-21-3	0.310000	100.000000	7.428210
		Die Total		0.310000	100.000000	7.428210

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	1.681778	96.487570	40.298718
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.040089	2.300000	0.960611
Lead Frame	Copper alloy	Zinc (Zn)	7440-66-6	0.001743	0.100000	0.041766
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.001743	0.100000	0.041766
Lead Frame	Impurity	Lead (Pb)	7439-92-1	0.000174	0.010000	0.004177
Lead Frame	Impurity	Tin (Sn)	7440-31-5	0.000042	0.002430	0.001015
Lead Frame	Impurity	Non-declarable		0.000002	0.000100	0.000042
		Base Alloy Total		1.725571	99.000100	41.348095
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.017429	0.999900	0.417615
		Pre-Plating Total		0.017429	0.999900	0.417615
		Lead Frame Total		1.743000	100.000000	41.765710

Mould Compound	Filler	Silica fused	60676-86-0	1.639180	82.000000	39.277978
Mould Compound	Filler	Silica	7631-86-9	0.159920	8.000000	3.831998
Mould Compound	Polymer	Phenolic resin		0.079960	4.000000	1.915999
Mould Compound	Polymer	Epoxy resin system		0.079960	4.000000	1.915999
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.029985	1.500000	0.718500
Mould Compound	Pigment	Carbon black	1333-86-4	0.009995	0.500000	0.239499
		Mould Compound Total		1.999000	100.000000	47.899973

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.090993	99.991800	2.180360
Post-Plating	Tin alloy	Lead (Pb)	7439-92-1	0.000003	0.003500	0.000076
Post-Plating	Tin alloy	Bismuth (Bi)	7440-69-9	0.000002	0.001700	0.000037
Post-Plating	Tin alloy	Iron (Fe)	7439-89-6	0.000001	0.000800	0.000017
Post-Plating	Tin alloy	Antimony (Sb)	7440-36-0	0.000001	0.000900	0.000020
Post-Plating	Tin alloy	Aluminium (Al)	7429-90-5	0.000000	0.000100	0.000002
Post-Plating	Tin alloy	Copper (Cu)	7440-50-8	0.000000	0.000300	0.000007
Post-Plating	Tin alloy	Zinc (Zn)	7440-66-6	0.000000	0.000100	0.000002
Post-Plating	Tin alloy	Arsenic (As)	7440-38-2	0.000000	0.000500	0.000011
Post-Plating	Tin alloy	Cadmium (Cd)	7440-43-9	0.000000	0.000300	0.000007
		Post-Plating Total		0.091000	100.000000	2.180539

Wire	Copper alloy	Copper (Cu)	7440-50-8	0.002201	96.540348	0.052743
Wire	Impurity	Non-declarable		0.000000	0.009659	0.000005
Wire	Impurity	Non-declarable		0.000000	0.000998	0.000001
Wire	Impurity	Non-declarable		0.000000	0.000998	0.000001
Wire	Pure metal layer	Palladium (Pd)	7440-05-3	0.000071	3.098999	0.001692
		Wire Coating 1 Total		0.000071	3.098999	0.001692
Wire	Pure metal layer	Gold (Au)	7440-57-5	0.000008	0.348998	0.000191
		Wire Coating 2 Total		0.000008	0.348998	0.000191
		Wire Total		0.002280	100.000000	0.054633

		PHDMI2FC4 Total		4.173280	100.000000	100.000000

Notes
Report created on 2024-12-18 14:37:57 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2024-12-18 14:37:57 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)	◯	◯	◯	◯	◯	◯
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
基底合金 (Base Alloy)	◯	◯	◯	◯	◯	◯
预镀层 (Pre-Plating)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯
后镀层 (Post-Plating)	◯	◯	◯	◯	◯	◯
导线 (Wire)	◯	◯	◯	◯	◯	◯
导线涂层1 (Wire Coating 1)	◯	◯	◯	◯	◯	◯
导线涂层2 (Wire Coating 2)	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-12-18 14:37:57 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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Chemical content PHDMI2FC4

Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PHDMI2FC4