Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG3005EL-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG3005EL-QSOD882DFN1006-20.914700 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346683773151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.830874
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.114464
Phenolic resinProprietary0.00135313.5300000.147917
subTotal0.010000100.0000001.093255
DieDoped siliconSilicon (Si)7440-21-30.020000100.0000002.186509
subTotal0.020000100.0000002.186509
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000042.353668
Magnesium (Mg)7439-95-40.0008200.2000000.089647
Nickel (Ni)7440-02-00.0129153.1500001.411938
Silicon (Si)7440-21-30.0028290.6900000.309282
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013447
Nickel (Ni)7440-02-00.0052071.2700000.569258
Palladium (Pd)7440-05-30.0006970.1700000.076200
subTotal0.410000100.00000044.823439
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.315185
Silica fused60676-86-00.27000060.00000029.517875
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.475894
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.245982
PigmentCarbon black1333-86-40.0022500.5000000.245982
PolymerEpoxy resin systemProprietary0.0315007.0000003.443752
Phenolic resinProprietary0.0270006.0000002.951787
subTotal0.450000100.00000049.196458
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000098
Non hazardousProprietary0.0000110.0555000.001214
Tin solderTin (Sn)7440-31-50.01998899.9400002.185197
subTotal0.020000100.0000002.186509
WireImpurityNon hazardousProprietary0.0000000.0100000.000052
Pure metalGold (Au)7440-57-50.00472099.9900000.515965
subTotal0.004720100.0000000.516016
total0.914700100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.